X-On Electronics has gained recognition as a prominent supplier of SSM6J213FE(TE85L,F MOSFETs across the USA, India, Europe, Australia, and various other global locations. SSM6J213FE(TE85L,F MOSFETs are a product manufactured by Toshiba. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

SSM6J213FE(TE85L,F Toshiba

SSM6J213FE(TE85L,F electronic component of Toshiba
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Part No.SSM6J213FE(TE85L,F
Manufacturer: Toshiba
Category: MOSFETs
Description: Toshiba MOSFET P-Ch U-MOS VI FET ID -2.6A -20V 290pF
Datasheet: SSM6J213FE(TE85L,F Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
95: USD 0.429 ea
Line Total: USD 40.76 
Availability - 491
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ: 95  Multiples: 1
Pack Size: 1
Availability Price Quantity
491
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 95
Multiples : 1
95 : USD 0.429
141 : USD 0.2893
200 : USD 0.2877
500 : USD 0.221

3686
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 341
Multiples : 1
341 : USD 0.2995
500 : USD 0.2887
1000 : USD 0.2794
2500 : USD 0.271

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Configuration
Series
Brand
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Height
Length
Transistor Type
Width
Cnhts
Hts Code
Mxhts
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the SSM6J213FE(TE85L,F from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the SSM6J213FE(TE85L,F and other electronic components in the MOSFETs category and beyond.

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SSM6J213FE TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type (U-MOS) SSM6J213FE Power Management Switch Applications Unit: mm 1.5-V drive Low ON-resistance: R = 250 m (max) ( V = -1.5 V) DS(ON) GS R = 178 m (max) ( V = -1.8 V) DS(ON) GS R = 133 m (max) ( V = -2.5 V) DS(ON) GS R = 103 m (max) ( V = -4.5 V) DS(ON) GS Absolute Maximum Ratings (Ta = 25C) Characteristic Symbol Rating Unit Drain-source voltage V -20 V DSS Gate-source voltage V 8 V GSS I (Note 1) DC -2.6 D Drain current A I (Note 1) Pulse DP -5.2 P (Note 2) D 500 Power dissipation mW t = 10s 700 1,2,5,6 Drain Channel temperature T 150 C ch ES6 3 Gate Storage temperature range T 55 to 150 C stg 4 Source Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in JEDEC temperature, etc.) may cause this product to decrease in the JEITA reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the TOSHIBA 2-2N1J absolute maximum ratings. Weight: 3mg (typ.) Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: The channel temperature should not exceed 150C during use. Note 2: Mounted on a FR4 board. 2 (25.4 mm 25.4 mm 1.6 mm, Cu Pad: 645 mm ) Marking (Top View) Equivalent Circuit 6 5 4 6 5 4 PS 123 1 2 3 Start of commercial production 2011-01 1 2014-03-01 SSM6J213FE Electrical Characteristics (Ta = 25C) Characteristic Symbol Test Conditions Min Typ. Max Unit V I = -1 mA, V = 0 V -20 V (BR) DSS D GS Drain-source breakdown voltage V I = -1 mA, V = 5 V (Note 4) -15 V (BR) DSX D GS Drain cut-off current I V = -20 V, V = 0 V -1 A DSS DS GS Gate leakage current I V = 8 V, V = 0 V 1 A GSS GS DS Gate threshold voltage V V = -3 V, I = -1 mA -0.3 -1.0 V th DS D Forward transfer admittance Y V = -3 V, I = -1.0 A (Note 3) 2.8 5.6 S fs DS D I = -1.5 A, V = -4.5 V (Note 3) 103 88.5 D GS I = -1.0 A, V = -2.5 V (Note 3) 107.5 133 D GS Drainsource ON-resistance R m DS (ON) I = -0.5 A, V = -1.8 V (Note 3) 130 178 D GS I = -0.25 A, V = -1.5 V (Note 3) 250 151 D GS Input capacitance C 290 iss V = -10 V, V = 0 V DS GS pF Output capacitance C 44 oss f = 1 MHz Reverse transfer capacitance C 32 rss Turn-on time t V = -10 V, I = -0.5 A 12.0 on DD D Switching time ns V = 0 to -2.5 V, R = 4.7 Turn-off time t 46.2 GS G off Total gate charge Q 4.7 g V = -10 V, I = -2.0 A, DD D nC Gate-source charge Q 0.4 gs1 V = -4.5 V GS Gate-drain charge Q 1.0 gd Drain-source forward voltage V I = 2.6 A, V = 0 V (Note 3) 0.89 1.2 V DSF D GS Note3: Pulse test Note4: If a forward bias is applied between gate and source, this device enters V mode. Note that the (BR)DSX drain-source breakdown voltage is lowered in this mode. Switching Time Test Circuit (a) Test Circuit 0 V (b) V IN OUT 90% 0 IN 10% 2.5V R 2.5 V L (c) V 10 s OUT V V DD DS (ON) 90% V = -10 V DD R = 4.7 G 10% V Duty 1% DD t t r f V : t , t < 5 ns IN r f Common Source t t on off Ta = 25C Notice on Usage V can be expressed as the voltage between gate and source when the low operating current value is I = -1 mA for th D this product. For normal switching operation, V requires a higher voltage than V and V requires a lower GS (on) th GS (off) voltage than V (The relationship can be established as follows: V < V < V ) th. GS (off) th GS (on). Take this into consideration when using the device. Handling Precaution When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that come into direct contact with devices should be made of antistatic materials. Thermal resistance R and power dissipation P vary depending on board material, board area, board thickness th (ch-a) D and pad area. When using this device, please take heat dissipation into consideration 2 2014-03-01 R G

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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