X-On Electronics has gained recognition as a prominent supplier of W29N02GVBIAA NAND Flash across the USA, India, Europe, Australia, and various other global locations. W29N02GVBIAA NAND Flash are a product manufactured by Winbond. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

W29N02GVBIAA Winbond

Name: W29N02GVBIAA
Brand: Winbond
SKU: W29N02GVBIAA_Winbond
Availability: OutOfStock
Rating: 5 (11 reviews)

W29N02GVBIAA electronic component of Winbond

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See Product Specifications

Part No.	W29N02GVBIAA
Manufacturer:	Winbond
Category:	NAND Flash
Description:	NAND Flash Serial 3V 2G-bit 256M x 8 25ns
Datasheet:	W29N02GVBIAA Datasheet (PDF)
	Large This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges

Price (USD)

3: USD 3.7766 ea
Line Total: USD 11.33

Availability - 0

MOQ: 3 Multiples: 3
Pack Size: 3

W29N02GVBIAA More Buying Options & Price Grid(s)

Availability	Price	Buy Price	Quantity
0 Ship by Fri. 27 Dec to Thu. 02 Jan MOQ : 210 Multiples : 1	210 : USD 5.3395

0 Ship by Wed. 25 Dec to Fri. 27 Dec MOQ : 210 Multiples : 210	210 : USD 4.4121

0 Ship by Fri. 27 Dec to Thu. 02 Jan MOQ : 3 Multiples : 3	3 : USD 3.7766 10 : USD 3.2251 25 : USD 3.1735 50 : USD 3.0279 100 : USD 2.856 250 : USD 2.7988

0 Ship by Fri. 27 Dec to Thu. 02 Jan MOQ : 3 Multiples : 3	3 : USD 3.7766 10 : USD 3.2251 25 : USD 3.1735 50 : USD 3.0278 100 : USD 2.856 250 : USD 2.7988

We are delighted to provide the W29N02GVBIAA from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W29N02GVBIAA and other electronic components in the NAND Flash category and beyond.

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Additional Infomation About Product

W29N02GV W29N02GV 2G-BIT 3.3V NAND FLASH MEMORY th Release Date: December 4 , 2017 1 Revision C W29N02GV Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................ 7 2. FEATURES .................................................................................................................................... 7 3. PACKAGE TYPES AND PIN CONFIGURATIONS ....................................................................... 8 3.1 Pin assignment 48-pin TSOP1(x8) ....................................................................................... 8 3.2 Pin assignment 63 ball VFBGA (x8) ..................................................................................... 9 3.3 Pin Descriptions .................................................................................................................. 10 4. PIN DESCRITPIONS ................................................................................................................... 11 4.1 Chip Enable ( CE) .............................................................................................................. 11 4.2 Write Enable ( WE) ............................................................................................................ 11 4.3 Read Enable ( RE) ............................................................................................................. 11 4.4 Address Latch Enable (ALE) .............................................................................................. 11 4.5 Command Latch Enable (CLE) ........................................................................................... 11 4.6 Write Protect ( WP) ............................................................................................................ 11 4.7 Ready/Busy (RY/ BY) ........................................................................................................ 11 4.8 Input and Output (I/Ox) ....................................................................................................... 11 5. BLOCK DIAGRAM ....................................................................................................................... 12 6. MEMORY ARRAY ORGANIZATION ........................................................................................... 13 6.1 Array Organization (x8) ....................................................................................................... 13 7. MODE SELECTION TABLE ........................................................................................................ 14 8. COMMAND TABLE ...................................................................................................................... 15 9. DEVICE OPERATIONS ............................................................................................................... 17 9.1 READ operation .................................................................................................................. 17 9.1.1 PAGE READ (00h-30h) ........................................................................................................ 17 9.1.2 CACHE READ OPERATIONS .............................................................................................. 17 9.1.3 TWO PLANE READ (00h-00h-30h) ...................................................................................... 21 9.1.4 RANDOM DATA OUTPUT (05h-E0h) ................................................................................... 23 9.1.5 READ ID (90h) ...................................................................................................................... 25 9.1.6 READ PARAMETER PAGE (ECh) ....................................................................................... 26 9.1.7 READ STATUS (70h) ........................................................................................................... 28 9.1.8 READ STATUS ENHANCED (78h) ...................................................................................... 30 9.1.9 READ UNIQUE ID (EDh) ...................................................................................................... 31 9.2 PROGRAM operation ......................................................................................................... 32 9.2.1 PAGE PROGRAM (80h-10h) ................................................................................................ 32 9.2.2 SERIAL DATA INPUT (80h) ................................................................................................. 32 9.2.3 RANDOM DATA INPUT (85h) .............................................................................................. 33 9.2.4 CACHE PROGRAM (80h-15h) ............................................................................................. 33 9.2.5 TWO PLANE PAGE PROGRAM .......................................................................................... 35 9.3 COPY BACK operation ....................................................................................................... 38 9.3.1 READ for COPY BACK (00h-35h) ........................................................................................ 38 9.3.2 PROGRAM for COPY BACK (85h-10h) ................................................................................ 38 9.3.3 TWO PLANE READ for COPY BACK ................................................................................... 39 9.3.4 TWO PLANE PROGRAM for COPY BACK .......................................................................... 39 9.4 BLOCK ERASE operation .................................................................................................. 43 th Release Date: December 4 , 2017 2 Revision C

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond Elec may also be referenced as

WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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Manufacturer Winbond Winbond
Product Category NAND Flash NAND Flash
Mounting Style SMD/SMT SMD/SMT
Package / Case VFBGA - 63 VFBGA - 63
Series W29N02GV W29N02GV
Memory Size 2 Gbit 2 Gbit
Interface Type Parallel Parallel
Organisation 256 M x 8 256 M x 8
Data Bus Width 8 bit 8 bit
Supply Voltage - Min 2.7 V 2.7 V
Supply Voltage - Max 3.6 V 3.6 V
Supply Current - Max 35 mA 35 mA
Minimum Operating Temperature - 40 C - 40 C
Maximum Operating Temperature + 85 C + 85 C
Packaging Tray Tray
Hts Code 8542320051 8542320051