X-On Electronics has gained recognition as a prominent supplier of W632GU6NB-12 DRAM across the USA, India, Europe, Australia, and various other global locations. W632GU6NB-12 DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

W632GU6NB-12 Winbond

W632GU6NB-12 electronic component of Winbond
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Part No.W632GU6NB-12
Manufacturer: Winbond
Category: DRAM
Description: DRAM 2G DDR3L 1.35V SDRAM x16 800MHz
Datasheet: W632GU6NB-12 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 6.1334 ea
Line Total: USD 6.13 
Availability - 201
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
201
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 1
Multiples : 1
1 : USD 6.1334
10 : USD 5.4665
100 : USD 5.005
198 : USD 3.7869

   
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We are delighted to provide the W632GU6NB-12 from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W632GU6NB-12 and other electronic components in the DRAM category and beyond.

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The W632GU6NB-12 is a DRAM 2G DDR3L 1.35V SDRAM x16 800MHz module manufactured by Winbond. It is a low-voltage dynamic random-access memory (DRAM) chip, designed with a x16 interface and operating at 800 MHz clock speed. This high-speed SDRAM module is compliant with the JEDEC and PC3L-12800S specifications for DDR3L memory, and is suited for use in smartphones, tablets and other mobile devices. It has a 2GB capacity with an arrangement of 16 chips (x1) that are organized into 1024M Words (x16) of 16-bit wide DRAM on a 80-ball FBGA package with a 6-bit prefetch architecture. This type of memory offers high-level integration and fast data transfer rates for faster response time and increased performance. The W632GU6NB-12 also supports multiple power-saving features such as auto-sleep, auto-refresh and self-refresh, as well as an Indirect RAS refresh scheme that can help reduce power consumption on mobile devices.

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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