BAP142LX,315 NXP

BAP142LX Silicon PIN diode Rev. 2 6 August 2013 Product data sheet 1. Product profile 1.1 General description Planar PIN diode in a SOD882D leadless ultra small plastic SMD package. 1.2 Features and benefits High voltage, current controlled RF resistor Low diode capacitance Low losses at very low currents Very low series inductance For applications up to 3 GHz 1.3 Applications RF attenuators and switches 2. Pinning information Table 1. Discrete pinning Pin Description Simplified outline Symbol 1 1 cathode 2 anode 1 2 Transparent sym006 top view 1 The marking bar indicates the cathode. 3. Ordering information Table 2. Ordering information Type number Package Name Description Version BAP142LX DFN1006D-2 leadless ultra small plastic package 2 terminals SOD882D body 1 0.6 0.4 mm DFN1006D-2BAP142LX NXP Semiconductors Silicon PIN diode 4. Marking Table 3. Marking codes 1 Type number Marking code BAP142LX 1001 0010 1 For SOD882D binary marking code description, see Figure 1. 4.1 Binary marking code description CATHODE BAR READING DIRECTION VENDOR CODE READING EXAMPLE: 0111 1011 MARKING CODE (EXAMPLE) READING DIRECTION 006aac477 Fig 1. SOD882D binary marking code description example 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V reverse voltage - 50 V R I forward current - 100 mA F P total power dissipation T = 90 C- 130 mW tot sp T storage temperature 65 +150 C stg T junction temperature 65 +150 C j 6. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction 83 K/W th(j-sp) to solder point BAP142LX All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved. Product data sheet Rev. 2 6 August 2013 2 of 9