X-On Electronics has gained recognition as a prominent supplier of BF1218,115 RF MOSFET Transistors across the USA, India, Europe, Australia, and various other global locations. BF1218,115 RF MOSFET Transistors are a product manufactured by NXP. We provide cost-effective solutions for RF MOSFET Transistors, ensuring timely deliveries around the world.

BF1218,115 NXP

BF1218,115 electronic component of NXP
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Part No.BF1218,115
Manufacturer: NXP
Category: RF MOSFET Transistors
Description: Trans RF MOSFET N-CH 6V 0.03A 6-Pin TSSOP T/R
Datasheet: BF1218,115 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
41: USD 0.7876 ea
Line Total: USD 32.29 
Availability - 0
MOQ: 41  Multiples: 1
Pack Size: 1
   
Manufacturer
Product Category
Rohs Mouser
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We are delighted to provide the BF1218,115 from our RF MOSFET Transistors category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BF1218,115 and other electronic components in the RF MOSFET Transistors category and beyond.

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BF1218 Dual N-channel dual gate MOSFET Rev. 01 14 April 2010 Product data sheet 1. Product profile 1.1 General description The BF1218 is a combination of two dual gate MOSFET amplifiers with shared source and gate2 leads and an integrated switch. The integrated switch is operated by the gate1 bias of amplifier B. The source and substrate are interconnected. Internal bias circuits enable DC stabilization and a very good cross modulation performance during Automatic Gain Control (AGC). Integrated diodes between the gates and source protect against excessive input voltage surges. The transistor has a SOT363 micro-miniature plastic package. CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken during transport and handling. 1.2 Features and benefits Two low noise gain controlled amplifiers in a single package. One with a fully integrated bias and one with a partly integrated bias Internal switch to save external components Superior cross modulation performance during AGC High forward transfer admittance High forward transfer admittance to input capacitance ratio 1.3 Applications Gain controlled low noise amplifiers for VHF and UHF applications with 5 V supply voltage digital and analog television tuners professional communication equipmentBF1218 NXP Semiconductors Dual N-channel dual gate MOSFET 1.4 Quick reference data Table 1. Quick reference data Per MOSFET unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V drain-source voltage DC - - 6 V DS I drain current DC - - 30 mA D [1] P total power dissipation T 109 C - - 180 mW tot sp y forward transfer admittance f = 100 MHz; T = 25 C fs j amplifier A; I =19mA 26 31 41 mS D amplifier B; I =15mA 25 30 40 mS D C input capacitance at gate1 f = 100 MHz iss(G1) [2] amplifier A -2.1 2.6 pF [2] amplifier B -2.1 2.6 pF [2] C reverse transfer capacitance f = 100 MHz -20 - fF rss NF noise figure Y =Y S S(opt) amplifier A; f = 400 MHz - 0.9 1.5 dB amplifier B; f = 800 MHz - 1.4 2.0 dB Xmod cross modulation input level for k = 1 %; f =50MHz; w f =60MHz unw at 40 dB AGC [3] amplifier A 102 105 - dB V [4] amplifier B 102 105 - dB V T junction temperature - - 150 C j [1] T is the temperature at the soldering point of the source lead. sp [2] Calculated from S-parameters. [3] Measured in Figure 33 test circuit. [4] Measured in Figure 34 test circuit. 2. Pinning information Table 2. Discrete pinning Pin Description Simplified outline Graphic symbol 1 gate1 (AMP A) 6 5 4 2gate2 AMP A 3 gate1 (AMP B) G1A DA 4 drain (AMP B) 132 5source G2 S 6 drain (AMP A) G1B DB AMP B sym089 BF1218_1 All information provided in this document is subject to legal disclaimers. NXP B.V. 2010. All rights reserved. Product data sheet Rev. 01 14 April 2010 2 of 23

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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