MOSFET N-Channel, SUPERFET II, FRFET 650 V, 76 A, 41 m FCH041N65F-F085 Description SuperFET II Mosfet is ON Semiconductors brandnew high www.onsemi.com voltage superjunction (SJ) MOSFET family that is utilizing charge balance technology for outstanding low onresistance and lower gate charge performance. This technology is tailored to minimize V R MAX I MAX DS DS(ON) D conduction loss, provide superior switching performance, dv/dt rate 650 V 41 m 10 V 76 A and higher avalanche energy. Consequently, SuperFET II MOSFET is very well suited for the Soft switching and Hard Switching topologies like High Voltage Full Bridge and Half Bridge DCDC, Interleaved D Boost PFC, Boost PFC for HEVEV automotive. SuperFET II FRFET MOSFETs optimized body diode reverse recovery performance can remove additional component and improve system reliability. G Features S Typ. R = 34 m at V = 10 V, I = 38 A DS(on) GS D Typ. Q = 234 nC at V = 10 V, I = 38 A g(tot) GS D N-CHANNEL MOSFET UIS Capability AECQ101 Qualified and PPAP Capable S These Devices are PbFree and are RoHS Compliant D GG Applications Automotive On Board Charger Automotive DC/DC Converter for HEV TO2473LD CASE 340CK MARKING DIAGRAM Y&Z&3&K FCH041N65F F085 Y = ON Semiconductor Logo &Z = Assembly Plant Code &3 = Numeric Date Code &K = Lot Code FCH041N65FF085 = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: November, 2019 Rev. 4 FCH041N65FF085/DFCH041N65F F085 ABSOLUTE MAXIMUM RATINGS (T = 25C unless otherwise noted) C Symbol Parameter Value Unit V Drain to Source Voltage 650 V DSS V Gate to Source Voltage 20 V GSS I Drain Current Continuous (V = 10) T = 25C 76 A D GS C (Note 1) T = 100C 48 A C Pulsed Drain Current See Fig. 4 A E Single Pulsed Avalanche Rating (Note 2) 2025 mJ AS dv/dt MOSFET dv/dt 100 V/ns Peak Diode Recovery dv/dt (Note 3) 50 P Power Dissipation 595 W D Derate Above 25C 4.76 W/C T , T Operating and Storage Temperature Range 55 to + 150 C J STG Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Repetitive rating: pulsewidth limited by maximum junction temperature. 2. I = 15 A, R = 25 , starting T = 25 C. AS G J 3. I 38 A, di/dt 200 A/ s, V 380 V, starting T = 25 C. SD DD J PACKAGE MARKING AND ORDERING INFORMATION Device Marking Device Package Reel Size Tape Width Quantity FCH041N65F FCH041N65FF085 TO2473 30 Units THERMAL CHARACTERISTICS Symbol Parameter Value Unit R Thermal Resistance, Junction to Case, Max. 0.21 C/W JC R Thermal Resistance, Junction to Ambient, Max. (Note 4) 40 JA 4. R is the sum of the junctiontocase and casetoambient thermal resistance, where the case thermal reference is defined as the solder JA mounting surface of the drain pins. R is guaranteed by design, while R is determined by the board design. The maximum rating JC JA 2 presented here is based on mounting on a 1 in pad of 2oz copper. www.onsemi.com 2