X-On Electronics has gained recognition as a prominent supplier of FDG6316P MOSFETs across the USA, India, Europe, Australia, and various other global locations. FDG6316P MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

FDG6316P ON Semiconductor

FDG6316P electronic component of ON Semiconductor
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See Product Specifications
Part No.FDG6316P
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: Fairchild Semiconductor MOSFET P-Ch PowerTrench Specified 1.8V
Datasheet: FDG6316P Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
5: USD 0.339 ea
Line Total: USD 1.7 
Availability - 3293
Ship by Fri. 06 Dec to Wed. 11 Dec
MOQ: 5  Multiples: 5
Pack Size: 5
Availability Price Quantity
3293
Ship by Fri. 06 Dec to Wed. 11 Dec
MOQ : 5
Multiples : 5
5 : USD 0.339
50 : USD 0.27
150 : USD 0.2406
500 : USD 0.2037
3000 : USD 0.1872
6000 : USD 0.1774

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs - Gate-Source Breakdown Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Channel Mode
Configuration
Series
Brand
Forward Transconductance - Min
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

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This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
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We are delighted to provide the FDG6316P from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the FDG6316P and other electronic components in the MOSFETs category and beyond.

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MOSFET Specified, P-Channel, POWERTRENCH 1.8 V FDG6316P General Description www.onsemi.com This P Channel 1.8 V specified MOSFET uses ONSemiconductors advanced low voltage POWERTRENCH S process. It has been optimized for battery power management G D applications. D Features G S Pin 1 0.7 A, 12 V SC88/SC706/SOT363 R = 270 m V = 4.5 V DS(ON) GS CASE 419B02 R = 360 m V = 2.5 V DS(ON) GS R = 650 m V = 1.8 V DS(ON) GS MARKING DIAGRAM Low Gate Charge High Performance Trench Technology for Extremely Low R DS(ON) Compact Industry Standard SC706 Surface Mount Package 16M These Devices are PbFree and are RoHS Compliant Applications Battery Management 16 = Specific Device Code M = Assembly Operation Month Load Switch PIN CONNECTIONS ABSOLUTE MAXIMUM RATINGS (T = 25C unless otherwise noted) A Symbol Parameter Ratings Units V DrainSource Voltage 12 V DSS S 1 or 4 6 or 3 D V GateSource Voltage 8 V GSS I Drain Current Continuous 0.7 A D (Note 1) G 2 or 5 5 or 2 G Pulsed 1.8 P Power Dissipation for (Note 1) 0.3 W D 3 or 6 4 or 1 S D Single Operation T , T Operating and Storage Junction 55 to +150 C J STG Temperature Range The pinouts are symmetrical pin 1 and 4 are interchangeable Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. THERMAL CHARACTERISTICS Symbol Parameter Ratings Unit R Thermal Resistance, JunctiontoAmbient (Note 1) 415 C/W JA 1. R is the sum of the junctiontocase and casetoambient thermal resistance where the case thermal reference is defined as the solder JA mounting surface of the drain pins. R is guaranteed by design while R is determined by the users board design. R = 415C/W when JC JA JA mounted on a minimum pad of FR4 PCB on still air environment. Semiconductor Components Industries, LLC, 2001 1 Publication Order Number: June, 2020 Rev. 4 FDG6316P/DFDG6316P PACKAGE MARKING AND ORDERING INFORMATION Device Marking Device Reel Size Tape Width Shipping 16 FDG6316P 7 8 mm 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) A Symbol Parameter Test Conditions Min Typ Max Unit OFF CHARACTERISTICS BV DrainSource Breakdown Voltage V =0V, I = 250 A 12 V DSS GS D BV / T Breakdown Voltage Temperature I = 250 A, Referenced to 25 C 3.7 mV/ C DSS J D Coefficient I Zero Gate Voltage Drain Current V = 10 V, V =0V 1 A DSS DS GS I GateBody Leakage, Forward V = 8V, V =0V 100 nA GSSF GS DS I GateBody Leakage, Reverse V =8V, V =0V 100 nA GSSR GS DS ON CHARACTERISTICS (Note 2) V Gate Threshold Voltage V =V , I = 250 A 0.4 0.6 1.5 V GS(th) DS GS D V / T Gate Threshold Voltage I = 250 A, Referenced to 25 C 2 mV/ C GS(th) J D Temperature Coefficient R Static DrainSource V = 4.5 V, I = 0.7 A 221 370 m DS(on) GS D OnResistance V = 2.5 V, I = 0.5 A 297 360 GS D V = 1.8 V, I = 0.4 A 427 650 GS D V = 4.5 V, I = 0.7 A, T = 125 C 250 348 GS D J I OnState Drain Current V = 4.5 V, V = 5V 1.8 A D(on) GS DS g Forward Transconductance V = 5V, I = 0.7 A 2.5 S FS DS D DYNAMIC CHARACTERISTICS C Input Capacitance V = 6V, V = 0 V, f = 1.0 MHz 146 pF iss DS GS C Output Capacitance 60 pF oss C Reverse Transfer Capacitance 48 pF rss SWITCHING CHARACTERISTICS (Note 2) t Turn-On Delay Time V = 6V, I = 1A, 5 10 ns d(on) DD D V = 4.5 V, R =6 GS GEN t Turn-On Rise Time 13 23 ns r t Turn-Off Delay Time 8 16 ns d(off) t Turn-Off Fall Time 2 4 ns f Q Total Gate Charge V = 6V, I = 0.7 A, 1.7 2.4 nC g DS D V = 4.5 V GS Q GateSource Charge 0.3 nC gs Q GateDrain Charge 0.4 nC gd DRAINSOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS I Maximum Continuous DrainSource Diode Forward Current 0.25 A S V DrainSource Diode Forward V =0V, I = 0.25 A (Note 2) 0.7 1.2 V SD GS S Voltage Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0% www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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