X-On Electronics has gained recognition as a prominent supplier of FDG6321C MOSFETs across the USA, India, Europe, Australia, and various other global locations. FDG6321C MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

FDG6321C ON Semiconductor

FDG6321C electronic component of ON Semiconductor
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Part No.FDG6321C
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: MOSFET SC70-6 COMP N-P-CH
Datasheet: FDG6321C Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 0.5764 ea
Line Total: USD 0.58 
Availability - 43640
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
193
Ship by Fri. 06 Dec to Wed. 11 Dec
MOQ : 1
Multiples : 1
1 : USD 0.4829
10 : USD 0.376
30 : USD 0.3283
100 : USD 0.2711
500 : USD 0.2463
1000 : USD 0.2291

43640
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 0.5764
10 : USD 0.385
100 : USD 0.2695
500 : USD 0.2178
1000 : USD 0.2013
3000 : USD 0.1804
6000 : USD 0.1727
9000 : USD 0.165

5614
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 0.728
10 : USD 0.4914
61 : USD 0.2842
166 : USD 0.2688
1000 : USD 0.259

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
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Technology
Number of Channels
Vgs - Gate-Source Voltage
Channel Mode
Configuration
Series
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Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Gate-Source Breakdown Voltage
Power Dissipation
Rds On
Fall Time
Rise Time
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Typical Turn-Off Delay Time
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We are delighted to provide the FDG6321C from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the FDG6321C and other electronic components in the MOSFETs category and beyond.

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Digital FET, Dual N & P Channel FDG6321C General Description These dual N & PChannel logic level enhancement mode field www.onsemi.com effect transistors are produced using ON Semiconductors proprietary, high cell density, DMOS technology. This very high density process is S2 especially tailored to minimize onstate resistance. This device has G2 D1 been designed especially on low voltage replacement for bipolar digital transistors and small signal MOSFETS. Since bias resistors are D2 G1 not required, this dual digital FET can replace several different digital S1 transistors, with different bias resistor values. SC88/SC706/SOT363 CASE 419B02 Features NCh 0.50 A, 25 V MARKING DIAGRAM R = 0.45 V = 4.5 V DS(ON) GS R = 0.60 V = 2.7 V DS(ON) GS 21M PCh 0.41 A, 25 V R = 1.1 V = 4.5 V DS(ON) GS R = 1.5 V = 2.7 V DS(ON) GS 21 = Specific Device Code Very Small Package Outline SC706 M = Assembly Operation Month Very Low Level Gate Drive Requirements Allowing Direct Operation in 3 V Circuits (V < 1.5 V) GS(th) PIN CONNECTIONS GateSource Zener for ESD Ruggedness (>6 kV Human Body Model) 1 6 These Devices are PbFree and are RoHS Compliant ABSOLUTE MAXIMUM RATINGS (T = 25C unless otherwise noted) A 2 5 Symbol Parameter NChannel PChannel Units V DrainSource Voltage 25 25 V DSS 3 4 V GateSource Voltage 8 8 V GSS I Drain Current Continuous 0.5 0.41 A D Pulsed 1.5 1.2 ORDERING INFORMATION P Maximum Power Dissipation 0.3 W D See detailed ordering and shipping information on page 8 of (Note 1) this data sheet. T , T Operating and Storage 55 to 150 C J STG Temperature Range ESD Electrostatic Discharge 6 kV Rating MILSTD883D Human Body Model (100 pF / 1500 ) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Semiconductor Components Industries, LLC, 1998 1 Publication Order Number: June, 2020 Rev. 5 FDG6321C/DFDG6321C THERMAL CHARACTERISTICS Symbol Parameter Ratings Unit R Thermal Resistance, JunctiontoAmbient (Note 1) 415 C/W JA 1. R is the sum of the junctiontocase and casetoambient thermal resistance where the case thermal reference is defined as the solder JA mounting surface of the drain pins. R is guaranteed by design while R is determined by the users board design. R = 415C/W on JC CA JA minimum pad mounting on FR 4 board in still air. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) A Symbol Parameter Conditions Type Min Typ Max Unit OFF CHARACTERISTICS BV DrainSource Breakdown Voltage V V =0V, I = 250 A NCh 25 DSS GS D V =0V, I = 250 A PCh 25 GS D BV / T Breakdown Voltage Temperature I = 250 A, Referenced to 25 C NCh 26 mV/ C DSS J D Coefficient I = 250 A, Referenced to 25 C PCh 22 D I Zero Gate Voltage Drain Current V =20V, V =0V NCh 1 A DSS DS GS V =20V, V =0V, T = 55 C 10 DS GS J I GateBody Leakage Current V = 20 V, V =0V PCh 1 A GSS DS GS V = 20 V, V =0V, T = 55 C 10 DS GS J I GateBody Leakage Current V =8V, V =0V NCh 100 nA GSS GS DS V = 8V, V =0V PCh 100 GS DS ON CHARACTERISTICS (Note 2) V Gate Threshold Voltage NCh 0.65 0.8 1.5 V V =V , I = 250 A GS(th) DS GS D V =V , I = 250 A PCh 0.65 0.82 1.5 DS GS D V / T Gate Threshold Voltage I = 250 A, Referenced to 25 C NCh 2.6 mV/ C GS(th) J D Temperature Coefficient I = 250 A, Referenced to 25 C PCh 2.1 D R Static DrainSource V = 4.5 V, I = 0.5 A NCh 0.34 0.45 DS(ON) GS D OnResistance V = 4.5 V, I = 0.5 A, T = 125 C 0.55 0.72 GS D J V = 2.7 V, I = 0.2 A 0.44 0.6 GS D V = 4.5 V, I = 0.41 A PCh 0.85 1.1 GS D V = 4.5 V, I = 0.41 A, 1.2 1.8 GS D T = 125 C J V = 2.7 V, I = 0.05 A 1.15 1.5 GS D I OnState Drain Current V = 4.5 V, V =5V NCh 0.5 A D(ON) GS DS V = 4.5 V, V = 5V PCh 0.41 GS DS g Forward Transconductance V =5V, I = 0.5 A NCh 1.45 S FS DS D V = 5V, I = 0.41 A PCh 0.9 DS D DYNAMIC CHARACTERISTICS C Input Capacitance NChannel NCh 50 pF iss V =10V, V = 0 V, f = 1.0 MHz DS GS PCh 62 PChannel C Output Capacitance NCh 28 oss V = 10 V, V =0V, DS GS f = 1.0 MHz PCh 34 C Reverse Transfer Capacitance NCh 9 rss PCh 10 www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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