X-On Electronics has gained recognition as a prominent supplier of FDG6322C MOSFET across the USA, India, Europe, Australia, and various other global locations. FDG6322C MOSFET are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFET, ensuring timely deliveries around the world.

FDG6322C ON Semiconductor

FDG6322C electronic component of ON Semiconductor
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See Product Specifications
Part No.FDG6322C
Manufacturer: ON Semiconductor
Category: MOSFET
Description: MOSFET SC70-6 COMP N-P-CH
Datasheet: FDG6322C Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

3000: USD 0.1871 ea
Line Total: USD 561.3

Availability - 8730
Ship by Thu. 01 Aug to Wed. 07 Aug
MOQ: 3000  Multiples: 3000
Pack Size: 3000
Availability Price Quantity
71
Ship by Thu. 08 Aug to Tue. 13 Aug
MOQ : 1
Multiples : 1
1 : USD 0.3939
10 : USD 0.3095
30 : USD 0.2739
100 : USD 0.2288
500 : USD 0.2102
1000 : USD 0.1969

2464
Ship by Thu. 01 Aug to Wed. 07 Aug
MOQ : 1
Multiples : 1
1 : USD 0.455
10 : USD 0.3809
64 : USD 0.26
176 : USD 0.2457
500 : USD 0.2366

8730
Ship by Thu. 01 Aug to Wed. 07 Aug
MOQ : 3000
Multiples : 3000
3000 : USD 0.1871
9000 : USD 0.172
24000 : USD 0.1667
45000 : USD 0.166

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Channel Mode
Configuration
Height
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Product
Series
Transistor Type
Type
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Brand
Forward Transconductance - Min
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Factory Pack Quantity :
Typical Turn-Off Delay Time
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We are delighted to provide the FDG6322C from our MOSFET category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the FDG6322C and other electronic components in the MOSFET category and beyond.

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ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided as-is and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. DG 6 annel A , 25 V, R = 4.0 V V, R = 5.0 V V. A 1 , P R = 1.1 V -4.5V, N C R = 1.5 V V. field effect transistors are produced using ON Semiconductor s c Very small package outline SC70-6. high density proc ess is especially tailored to minimize on-state resis tance. This l direct operation in 3 V circuits (V < 1.5 V). GS(th) bipolar digital transistors and small s ignal MOSFETs. Since digital FET c an s kV 6 ith different bias resistor values. T M 8 1 66 G2 Q1 D1 2 5 D2 Q2 n 1 3 4 SC70-6 o T A V V DSS V 8 V I A D P W D T J 6 R ) JA Publication Order Number: 2012 Semiconductor Components Industries, LLC. FDG6322C/D October-2017, Rev. 6 C/W 415 (Note1 Thermal Resistance, Junction-to-Ambient THERMAL CHARACTERISTICS Human Body Model (100pf / 1500 Ohm) kV Electrostatic Discharge Rating MIL-STD-883D ESD STG C -55 to 150 Operating and Storage Temper ature Range ,T 0.3 (Note 1) Maximum Power Dissipation -1.2 0.65 - Pulsed -0.41 0.22 Drain Current - Continuous GSS -8 Gate-Source Voltage -25 25 Drain-Source Voltage Units P-Channel N-Channel Parameter Symbol C unless other wise noted = 25 Absolute Maximum Ratings Mark: .22 S1 pi G1 S2 SOIC-14 -6 SuperSOT SOT-23 SO- SOT-8 SC70-6 transistors, w Human Body Model). (> digital different everal replace dual this ESD ruggedness Gate-Source Zener fo r required, not are resistors bias for replacement a as applications voltage low for especially designed been has Very ow level gate drive requirements allowing device very This technology. DMOS density, ell high proprietary, GS DS(ON) -2.7= mode ement enhanc level logic P- hannel & dual These GS DS(ON) = -Ch -0.4,-25V GS DS(ON) General Description 2.7 = GS DS(ON) 4.5 = N-Ch 0.22 Digital FET Dual N & P Ch Features 322C F

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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