X-On Electronics has gained recognition as a prominent supplier of FDMC86106LZ MOSFETs across the USA, India, Europe, Australia, and various other global locations. FDMC86106LZ MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

FDMC86106LZ ON Semiconductor

FDMC86106LZ electronic component of ON Semiconductor
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Part No.FDMC86106LZ
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: MOSFET 100V N-Channel PowerTrench MOSFET
Datasheet: FDMC86106LZ Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
697: USD 0.5389 ea
Line Total: USD 375.61 
Availability - 0
MOQ: 697  Multiples: 697
Pack Size: 697
Availability Price Quantity
0
Ship by Fri. 29 Nov to Thu. 05 Dec
MOQ : 697
Multiples : 697
697 : USD 0.5389

0
Ship by Wed. 27 Nov to Fri. 29 Nov
MOQ : 1
Multiples : 1
1 : USD 2.7752
10 : USD 0.9647
100 : USD 0.7803
500 : USD 0.7117
1000 : USD 0.6229
3000 : USD 0.5937
6000 : USD 0.5937
24000 : USD 0.5392

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Qg - Gate Charge
Series
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Power Dissipation
Rds On
Gate Charge Qg
Factory Pack Quantity :
Configuration
Height
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Width
Cnhts
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We are delighted to provide the FDMC86106LZ from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the FDMC86106LZ and other electronic components in the MOSFETs category and beyond.

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FDMC86106LZ N-Channel Shielded Gate PowerTrench MOSFET November 2013 FDMC86106LZ N-Channel Shielded Gate PowerTrench MOSFET 100 V, 7.5 A, 103 m Features General Description Shielded Gate MOSFET Technology This N-Channel logic Level MOSFETs are produced using Fairchild Semiconductors advanced PowerTrench process Max r = 103 m at V = 10 V, I = 3.3 A DS(on) GS D that incorporates Shielded Gate technology. This process has Max r = 153 m at V = 4.5 V, I = 2.7 A been optimized for the on-state resistance and yet maintain DS(on) GS D superior switching performance. G-S zener has been added to HBM ESD protection level > 3 KV typical (Note 4) enhance ESD voltage level. 100% UIL Tested RoHS Compliant Application DC - DC Conversion Bottom Top D D D D 8 7 6 5 S D S D D S D G G S S S 1 3 2 4 MLP 3.3x3.3 MOSFET Maximum Ratings T = 25 C unless otherwise noted A Symbol Parameter Ratings Units V Drain to Source Voltage 100 V DS V Gate to Source Voltage 20 V GS Drain Current -Continuous (Package limited) T = 25 C 7.5 C -Continuous (Silicon limited) T = 25 C 9.6 C I A D -Continuous T = 25 C (Note 1a) 3.3 A -Pulsed 15 E Single Pulse Avalanche Energy (Note 3) 12 mJ AS Power Dissipation T = 25 C 19 C P W D Power Dissipation T = 25 C (Note 1a) 2.3 A T , T Operating and Storage Junction Temperature Range -55 to +150 C J STG Thermal Characteristics R Thermal Resistance, Junction to Case 6.5 JC C/W R Thermal Resistance, Junction to Ambient (Note 1a) 53 JA Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FDMC86106Z FDMC86106LZ Power 33 13 12 mm 3000 units 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com 1 FDMC86106LZ Rev.C2 FDMC86106LZ N-Channel Shielded Gate PowerTrench MOSFET SS SF DS DF G SS SF DS DF G Electrical Characteristics T = 25 C unless otherwise noted J Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BV Drain to Source Breakdown Voltage I = 250 A, V = 0 V 100 V DSS D GS BV Breakdown Voltage Temperature DSS I = 250 A, referenced to 25 C 73 mV/C D T Coefficient J I Zero Gate Voltage Drain Current V = 80 V, V = 0 V 1 A DSS DS GS I Gate to Source Leakage Current V = 20 V, V = 0 V 10 A GSS GS DS On Characteristics V Gate to Source Threshold Voltage V = V , I = 250 A 1.0 1.8 2.2 V GS(th) GS DS D V Gate to Source Threshold Voltage GS(th) I = 250 A, referenced to 25 C -6 mV/C D T Temperature Coefficient J V = 10 V, I = 3.3 A 79 103 GS D r Static Drain to Source On Resistance V = 4.5 V, I = 2.7 A 105 153 m DS(on) GS D V = 10 V, I = 3.3 A, T = 125 C 136 178 GS D J g Forward Transconductance V = 5 V, I = 3.3 A 11 S FS DS D Dynamic Characteristics C Input Capacitance 232 310 pF iss V = 50 V, V = 0 V, DS GS C Output Capacitance 45 60 pF oss f = 1 MHz C Reverse Transfer Capacitance 2.4 5 pF rss R Gate Resistance 0.7 g Switching Characteristics t Turn-On Delay Time 4.5 10 ns d(on) t Rise Time 1.3 10 ns V = 50 V, I = 3.3 A, r DD D V = 10 V, R = 6 t Turn-Off Delay Time 10 20 ns GS GEN d(off) t Fall Time 1.4 10 ns f Q Total Gate Charge V = 0 V to 10 V 46 nC g(TOT) GS V = 50 V, DD Q Total Gate Charge V = 0 V to 4.5 V 2 3 nC g(TOT) GS I = 3.3 A D Q Total Gate Charge 0.8 nC gs Q Gate to Drain Miller Charge 0.7 nC gd Drain-Source Diode Characteristics V = 0 V, I = 3.3 A (Note 2) 0.85 1.3 GS S V Source to Drain Diode Forward Voltage V SD V = 0 V, I = 2 A (Note 2) 0.82 1.2 GS S t Reverse Recovery Time 33 54 ns rr I = 3.3 A, di/dt = 100 A/s F Q Reverse Recovery Charge 23 38 nC rr NOTES: 2 1. R is determined with the device mounted on a 1 in pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R is guaranteed by design while R is determined by JA JC CA the user s board design. b. 125 C/W when mounted on a. 53 C/W when mounted on a a minimum pad of 2 oz copper 2 1 in pad of 2 oz copper 2. Pulse Test: Pulse Width < 300 s, Duty cycle < 2.0%. 3. Starting T = 25 C N-ch: L = 1.0 mH, I = 5.0 A, V = 90 V, V = 10 V. J AS DD GS 4. The diode connected between gate and source serves only as protection against ESD. No gate overvoltage rating is implied. 2011 Fairchild Semiconductor Corporation www.fairchildsemi.com 2 FDMC86106LZ Rev.C2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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