ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided as-is and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. FDPF035N06B N-Channel PowerTrench MOSFET September 201 7 FDPF035N06B N-Channel PowerTrench MOSFET 60 V, 88 A, 3.5 m Features Description R = 2.91 m ( Typ.) V = 10 V, I = 88 A This N-Channel MOSFET is produced using ON Semicon ductor s DS(on) GS D advanced PowerTrench process that has been tai lored Low FOM R *Q DS(on) G to minimize the on-state resistance while maintaining Low Reverse Recovery Charge, Q rr superior switching performance. Soft Reverse Recovery Body Diode Enables Highly Efficiency in Synchronous Rectification Applications Fast Switching Speed 100% UIL Tested Synchronous Rectification for ATX / Server / Telecom PSU RoHS Compliant Battery Protection Circuit Motor Drives and Uninterruptible Power Supplies Renewable System D G G D S TO-220F S o Absolute Maximum Ratings T = 25 C unless otherwise noted. C Symbol Parameter FDPF035N06B-F152 Unit V Drain to Source Voltage 60 V DSS V Gate to Source Voltage 20 V GSS o - Continuous (T = 25 C, Silicon Limited) 88 C I Drain Current A D o - Continuous (T = 100 C, Silicon Limited) 62 C I Drain Current - Pulsed (Note 1) 352 A DM E Single Pulsed Avalanche Energy (Note 2) 600 mJ AS dv/dt Peak Diode Recovery dv/dt (Note 3) 6.0 V/ns o (T = 25 C) 46.3 W C P Power Dissipation D o o - Derate Above 25C0.31W/ C o T , T Operating and Storage Temperature Range -55 to +175 C J STG o T Maximum Lead Temperature for Soldering, 1/8 from Case for 5 Seconds 300 C L Thermal Characteristics Symbol Parameter Unit FDPF035N06B -F152 R Thermal Resistance, Junction to Case, Max. 3.24 JC o C/W R Thermal Resistance, Junction to Ambient, Max. 62.5 JA 2013 Semiconductor Components Industries, LLC. www. onsemi.com 1 FDPF035N06B Rev. 1