ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided as-is and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. MBR2H200SF Surface Mount Schottky Power Rectifier Plastic SOD123FL Package This device uses the Schottky Barrier principle with a large area www.onsemi.com metaltosilicon power diode. Ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection SCHOTTKY BARRIER diodes in surface mount applications where compact size and weight are critical to the system. Because of its small size, it is ideal for use in RECTIFIER portable and battery powered products such as cellular and cordless 2.0 AMPERES phones, chargers, notebook computers, printers, PDAs and PCMCIA 200 VOLTS cards. Typical applications are ACDC and DCDC converters, reverse battery protection, and Oring of multiple supply voltages and any other application where performance and size are critical. Features Guardring for Stress Protection Low Forward Voltage SOD123FL Epoxy Meets UL 94 V0 CASE 498 Package Designed for Optimal Automated Board Assembly These are PbFree Devices MARKING DIAGRAM Mechanical Characteristics Reel Options: MBR2H200SFT3G = 10,000 per 13 in reel/8 mm tape L2JM Device Marking: L2J Polarity Designator: Cathode Band L2J = Specific Device Code Weight: 11.7 mg (approximately) M = Date Code Case: Epoxy, Molded = PbFree Package Lead Finish: 100% Matte Sn (Tin) (Note: Microdot may be in either location) Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds ORDERING INFORMATION Device Meets MSL 1 Requirements Device Package Shipping MBR2H200SFT1G SOD123 3000 / Tape & (PbFree) Reel MBR2H200SFT3G SOD123 10000 / Tape & (PbFree) Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2017 1 Publication Order Number: January, 2017 Rev. 1 MBR2H200SF/D