NTJD4152P, NVJD4152P MOSFET Dual, P-Channel, Trench Small Signal, ESD Protected, SC-88 20 V, 0.88 A Features www.onsemi.com Leading Trench Technology for Low R Performance DS(ON) Small Footprint Package (SC706 Equivalent) V R Typ I Max (BR)DSS DS(on) D ESD Protected Gate 215 m 4.5 V NV Prefix for Automotive and Other Applications Requiring Unique 20 V 0.88 A Site and Control Change Requirements AECQ101 Qualified and 345 m 2.5 V PPAP Capable 600 m 1.8 V These are PbFree Devices Applications Load/Power Management S 1 6 D Charging Circuits 1 1 Load Switching Cell Phones, Computing, Digital Cameras, MP3s and PDAs G 2 5 G 1 2 MAXIMUM RATINGS (T = 25C unless otherwise stated) J Parameter Symbol Value Unit D 3 4 S 2 2 DraintoSource Voltage V 20 V DSS GatetoSource Voltage V 12 V GS Top View Continuous Drain Steady T = 25C I 0.88 A A D Current (Note 1) State T = 85C 0.63 A MARKING DIAGRAM & Power Dissipation Steady T = 25C P 0.272 W A D PIN ASSIGNMENT (Note 1) State T = 85C 0.141 A D1 G2 S2 T = 25C 1.0 Continuous Drain t 5 s I A A D 6 1 Current (Note 2) T = 85C 0.72 A SC88/SOT363 XXX M Power Dissipation t 5 s T = 25C P 0.35 W CASE 419B A D (Note 2) STYLE 26 T = 85C 0.181 A 1 Pulsed Drain Current t 10 s I 3.0 A S1 G1 D2 DM Operating Junction and Storage Temperature T , 55 to J C XXX = Device Code T 150 STG M = Date Code = PbFree Package Continuous Source Current (Body Diode) I 0.48 A S (Note: Microdot may be in either location) Lead Temperature for Soldering Purposes 260 C T L (1/8 from case for 10 s) THERMAL RESISTANCE RATINGS (Note 1) ORDERING INFORMATION See detailed ordering and shipping information in the package Parameter Symbol Max Unit dimensions section on page 5 of this data sheet. JunctiontoAmbient Steady State R 460 C/W JA JunctiontoAmbient t 5 s R 357 JA JunctiontoLead Steady State R 226 JL Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq 1 oz including traces), steady state. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: May, 2019 Rev. 6 NTJD4152P/DNTJD4152P, NVJD4152P 2. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq 1 oz including traces), t 5 s. www.onsemi.com 2