X-On Electronics has gained recognition as a prominent supplier of NTMFS4926NT1G MOSFETs across the USA, India, Europe, Australia, and various other global locations. NTMFS4926NT1G MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

NTMFS4926NT1G ON Semiconductor

NTMFS4926NT1G electronic component of ON Semiconductor
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Part No.NTMFS4926NT1G
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: MOSFET TRENCH 3.1 30V 7 Ohm NCH
Datasheet: NTMFS4926NT1G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.755 ea
Line Total: USD 1.76 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 1500
Multiples : 1500
1500 : USD 0.7454
3000 : USD 0.6194
6000 : USD 0.6131
12000 : USD 0.6069
15000 : USD 0.5947
24000 : USD 0.5947
30000 : USD 0.5947

0
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 1489
Multiples : 1489
1489 : USD 0.2523

0
Ship by Mon. 09 Dec to Thu. 12 Dec
MOQ : 1
Multiples : 1
1 : USD 0.5003
10 : USD 0.4159
30 : USD 0.3548
100 : USD 0.3044
500 : USD 0.2958
1000 : USD 0.2916

0
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 1.755
10 : USD 0.8271
100 : USD 0.4493
500 : USD 0.3532
1000 : USD 0.2732
1500 : USD 0.2473

0
Ship by Mon. 02 Dec to Fri. 06 Dec
MOQ : 1500
Multiples : 1500
1500 : USD 1.0003

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Configuration
Series
Brand
Continuous Drain Current
Drain-Source Breakdown Voltage
Forward Transconductance - Min
Gate-Source Breakdown Voltage
Power Dissipation
Rds On
Fall Time
Gate Charge Qg
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Transistor Type
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Typical Turn-On Delay Time
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We are delighted to provide the NTMFS4926NT1G from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the NTMFS4926NT1G and other electronic components in the MOSFETs category and beyond.

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NTMFS4926N MOSFET Power, Single, N-Channel, SO-8 FL 30 V, 44 A Features Low R to Minimize Conduction Losses DS(on) NTMFS4926N MAXIMUM RATINGS (T = 25C unless otherwise stated) J Parameter Symbol Value Unit Single Pulse DraintoSource Avalanche E 22 mJ AS Energy (T = 25C, V = 24 V, V = 20 V, J DD GS I = 21 A , L = 0.1 mH, R = 25 ) L pk G Lead Temperature for Soldering Purposes T 260 C L (1/8 from case for 10 s) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 2. Surfacemounted on FR4 board using the minimum recommended pad size. THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit JunctiontoCase (Drain) R 5.8 JC JunctiontoAmbient Steady State (Note 3) R 46.3 JA C/W JunctiontoAmbient Steady State (Note 4) R 136.2 JA JunctiontoAmbient (t 10 s) (Note 3) R 20.4 JA 3. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu. 4. Surfacemounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V 30 V V = 0 V, I = 250 A (BR)DSS GS D DraintoSource Breakdown Voltage V V = 0 V, I = 8.8 A, 34 V (BR)DSSt GS D(aval) (transient) T =25C, t = 100 ns case transient DraintoSource Breakdown Voltage V / 25 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25C 1.0 DSS GS J V = 24 V A DS T = 125C 10 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 5) Gate Threshold Voltage V V = V , I = 250 A 1.32 1.6 2.2 V GS(TH) GS DS D Negative Threshold Temperature Coefficient V /T 3.8 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 30 A 5.6 7.0 DS(on) GS D I = 15 A 5.6 D m V = 4.5 V I = 30 A 9.0 11.2 GS D I = 15 A 8.7 D Forward Transconductance g V = 1.5 V, I = 15 A 40 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C 1004 ISS Output Capacitance C 390 V = 0 V, f = 1 MHz, V = 15 V pF OSS GS DS Reverse Transfer Capacitance C 119 RSS Capacitance C / V = 0 V, V = 15 V, f = 1 MHz 0.119 0.237 RSS GS DS C ISS 5. Pulse Test: pulse width 300 s, duty cycle 2%. 6. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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