NTMFS5C646NL Power MOSFET 60 V, 4.7 m , 93 A, Single NChannel Features Small Footprint (5x6 mm) for Compact Design Low R to Minimize Conduction Losses DS(on) www.onsemi.com Low Q and Capacitance to Minimize Driver Losses G These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant V R MAX I MAX (BR)DSS DS(ON) D 4.7 m 10 V MAXIMUM RATINGS (T = 25C unless otherwise noted) 60 V J 93 A 6.3 m 4.5 V Parameter Symbol Value Unit DraintoSource Voltage V 60 V DSS GatetoSource Voltage V 20 V D (5) GS Continuous Drain T = 25C I 93 A C D Current R JC T = 100C 65 (Notes 1, 3) C Steady State Power Dissipation T = 25C P 79 W C D G (4) R (Note 1) JC T = 100C 40 C Continuous Drain T = 25C I 20 A S (1,2,3) A D Current R JA NCHANNEL MOSFET T = 100C 14 (Notes 1, 2, 3) A Steady State Power Dissipation T = 25C P 3.7 W A D R (Notes 1 & 2) JA MARKING T = 100C 1.8 A DIAGRAM Pulsed Drain Current T = 25C, t = 10 s I 750 A A p DM D 1 Operating Junction and Storage Temperature T , T 55 to C J stg S D +175 5C646L DFN5 S AYWZZ (SO8FL) S Source Current (Body Diode) I 100 A S CASE 488AA G D Single Pulse DraintoSource Avalanche E 185 mJ AS STYLE 1 D Energy (I = 5 A) L(pk) 5C646L = Specific Device Code Lead Temperature for Soldering Purposes T 260 C L A = Assembly Location (1/8 from case for 10 s) Y = Year Stresses exceeding those listed in the Maximum Ratings table may damage the W = Work Week device. If any of these limits are exceeded, device functionality should not be ZZ = Lot Traceability assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit ORDERING INFORMATION JunctiontoCase Steady State 1.9 C/W See detailed ordering, marking and shipping information in the R JC package dimensions section on page 5 of this data sheet. JunctiontoAmbient Steady State (Note 2) R 41 JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2 2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad. 3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: May, 2018 Rev. 5 NTMFS5C646NL/DNTMFS5C646NL ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 60 V (BR)DSS GS D DraintoSource Breakdown Voltage V / 15.5 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25 C 10 DSS GS J V = 60 V A DS T = 125C 250 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 4) Gate Threshold Voltage V V = V , I = 80 A 1.2 2.0 V GS(TH) GS DS D Threshold Temperature Coefficient V /T 4.9 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 50 A 3.8 4.7 DS(on) GS D m V = 4.5 V I = 50 A 5.0 6.3 GS D Forward Transconductance g V = 15 V, I = 50 A 105 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C 2164 ISS Output Capacitance C 900 V = 0 V, f = 1 MHz, V = 25 V pF OSS GS DS Reverse Transfer Capacitance C 17 RSS Total Gate Charge Q V = 4.5 V, V = 30 V I = 25 A 15.7 G(TOT) GS DS D Total Gate Charge Q V = 10 V, V = 30 V I = 25 A 33.7 G(TOT) GS DS D Threshold Gate Charge Q 1.5 nC G(TH) GatetoSource Charge Q 5.6 GS V = 4.5 V, V = 30 V I = 25 A GS DS D GatetoDrain Charge Q 5.1 GD Plateau Voltage V 2.8 V GP SWITCHING CHARACTERISTICS (Note 5) TurnOn Delay Time t 10.4 d(ON) Rise Time t 14.9 r V = 4.5 V, V = 30 V, GS DS ns I = 25 A, R = 2.5 D G TurnOff Delay Time t 23.6 d(OFF) Fall Time t 5.1 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.88 1.2 SD J V = 0 V, GS V I = 50 A S T = 125C 0.78 J Reverse Recovery Time t 40.9 RR Charge Time t 20.8 ns a V = 0 V, dIS/dt = 100 A/ s, GS I = 50 A S Discharge Time t 20.1 b Reverse Recovery Charge Q 32 nC RR 4. Pulse Test: pulse width 300 s, duty cycle 2%. 5. Switching characteristics are independent of operating junction temperatures. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. www.onsemi.com 2