X-On Electronics has gained recognition as a prominent supplier of NTR3A30PZT1G MOSFETs across the USA, India, Europe, Australia, and various other global locations. NTR3A30PZT1G MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

NTR3A30PZT1G ON Semiconductor

NTR3A30PZT1G electronic component of ON Semiconductor
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Part No.NTR3A30PZT1G
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: MOSFET PFET SOT23 20V 2.9A 38MOH
Datasheet: NTR3A30PZT1G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.067 ea
Line Total: USD 1.07 
Availability - 6390
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
6390
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ : 1
Multiples : 1
1 : USD 1.067
10 : USD 1.0593
100 : USD 1.0197
500 : USD 0.8514
1000 : USD 0.726
3000 : USD 0.308
6000 : USD 0.286

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs - Gate-Source Breakdown Voltage
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Series
Brand
Forward Transconductance - Min
Ciss - Input Capacitance
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Transistor Type
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Typical Turn-On Delay Time
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the NTR3A30PZT1G from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the NTR3A30PZT1G and other electronic components in the MOSFETs category and beyond.

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NTR3A30PZ MOSFET Power, Single P-Channel, SOT-23, 2.4 x 2.9 x 1.0 mm -20 V, -5.5 A www.onsemi.com Features Low R Solution in 2.4 mm x 2.9 mm Package DS(on) ESD DiodeProtected Gate V R Max I MAX (BR)DSS DS(on) D These Devices are PbFree, Halogen Free/BFR Free and are RoHS 38 m 4.5 V Compliant 20 V 50 m 2.5 V 5.5 A Applications High Side Load Switch 73 m 1.8 V Battery Switch Optimized for Power Management Applications for Portable Products, such as Smart Phones, Media Tablets, PMP, DSC, GPS, and PChannel MOSFET D 3 Others MAXIMUM RATINGS (T = 25C unless otherwise stated) J G Parameter Symbol Value Unit DraintoSource Voltage V 20 V DSS 1 GatetoSource Voltage V 8 V GS Drain Current (Note 1) Steady I A T = 25C 3.0 A D S 2 State Drain Current (Note 1) T = 85C 2.2 A t 5 s T = 25C 5.5 A MARKING DIAGRAM & PIN ASSIGNMENT Power Dissipation T = 25C P W Steady 0.48 A D (Note 1) State Drain 3 t 5 s 1.58 Pulsed Drain Current t = 10 s I 9.1 A p DM TRH M Operating Junction and Storage Temperature T , 55 to C J SOT23 T 150 STG CASE 318 1 2 STYLE 21 ESD HBM, JESD22A114 V 2000 V ESD Gate Source Source Current (Body Diode) (Note 2) I 0.48 A S TRH = Specific Device Code Lead Temperature for Soldering Purposes T 260 C M = Date Code* L (1/8 in from case for 10 s) = PbFree Package (Note: Microdot may be in either location) Stresses exceeding those listed in the Maximum Ratings table may damage the *Date Code orientation may vary depending device. If any of these limits are exceeded, device functionality should not be upon manufacturing location. assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE RATINGS Parameter Symbol Max Unit ORDERING INFORMATION JunctiontoAmbient Steady State (Note 1) R 260 C/W JA Device Package Shipping JunctiontoAmbient t 5 s (Note 1) R 79 JA NTR3A30PZT1G SOT23 3000 / Tape & 1. Surfacemounted on FR4 board using 1 in sq. pad size (PbFree) Reel (Cu area = 1.127 in sq. 2 oz including traces). For information on tape and reel specifications, 2. Pulse Test: pulse width 300 ms, duty cycle 2%. including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2012 1 Publication Order Number: June, 2019 Rev. 2 NTR3A30PZ/DNTR3A30PZ ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 20 V (BR)DSS GS D DraintoSource Breakdown Voltage V /T 10.5 mV/C (BR)DSS J I = 250 A, ref to 25C D Temperature Coefficient Zero Gate Voltage Drain Current I V = 0 V, 1 A DSS GS T = 25C J V = 20 V DS GatetoSource Leakage Current I V = 0 V, V = 5 V 10 A GSS DS GS ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V V = V , I = 250 A 0.4 0.65 1.0 V GS(TH) GS DS D Negative Threshold Temperature V /T 10.5 mV/C GS(TH) J Coefficient DraintoSource On Resistance R V = 4.5 V I = 3 A 31 38 m DS(on) GS D V = 2.5 V I = 2.5 A 36 50 GS D V = 1.8 V I = 1.5 A 51 73 GS D Forward Transconductance g V = 5 V, I = 3 A 30 S FS DS D CHARGES AND CAPACITANCES Input Capacitance C 1651 pF iss Output Capacitance C V = 0 V, f = 1.0 MHz, V = 15 V 148 oss GS DS Reverse Transfer Capacitance C 129 rss Total Gate Charge Q 17.6 nC G(TOT) Threshold Gate Charge Q 0.7 G(TH) V = 4.5 V, V = 15 V, I = 3 A GS DS D GatetoSource Charge Q 2.4 GS GatetoDrain Charge Q 4.9 GD SWITCHING CHARACTERISTICS (Note 4) TurnOn Delay Time t 100 ns d(on) Rise Time t 208 r V = 4.5 V, V = 15 V, GS DS I = 3 A, R = 6.0 D G TurnOff Delay Time t 1043 d(off) Fall Time t 552 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.65 1.0 V SD J V = 0 V, GS I = 0.4 A S T = 125C 0.47 J Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: pulse width 300 ms, duty cycle 2%. 4. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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