X-On Electronics has gained recognition as a prominent supplier of BSM180D12P3C007 Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. BSM180D12P3C007 Discrete Semiconductor Modules are a product manufactured by ROHM. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

BSM180D12P3C007 ROHM

BSM180D12P3C007 electronic component of ROHM
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Part No.BSM180D12P3C007
Manufacturer: ROHM
Category: Discrete Semiconductor Modules
Description: Discrete Semiconductor Modules Half Bridge Module SiC UMOSFET & SBD
Datasheet: BSM180D12P3C007 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 877.4999 ea
Line Total: USD 877.5 
Availability - 11
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
9
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 1
Multiples : 1
1 : USD 942.0183
2 : USD 916.0261
3 : USD 893.4182
5 : USD 873.644
10 : USD 856.263

11
Ship by Thu. 28 Nov to Wed. 04 Dec
MOQ : 1
Multiples : 1
1 : USD 877.4999
5 : USD 804.3749
10 : USD 754

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Type
Vgs - Gate-Source Voltage
Mounting Style
Package / Case
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Configuration
Operating Temperature Range
Brand
Fall Time
Id - Continuous Drain Current
Pd - Power Dissipation
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Vds - Drain-Source Breakdown Voltage
Vgs Th - Gate-Source Threshold Voltage
Number Of Channels
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the BSM180D12P3C007 from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BSM180D12P3C007 and other electronic components in the Discrete Semiconductor Modules category and beyond.

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10 9 8 7 6 5 SiC Power Module BSM180D12P3C007 Datasheet Application Circuit diagram Motor drive 1 Inverter, Converter 10 Photovoltaics, wind power generation. 9 8(N.C) 3,4 Induction heating equipment. 5 6 7(N.C) Features 2 *Do not connnect to NC pin. 1) Low surge, low switching loss. 2) High-speed switching possible. 3) Reduced temperature dependence. Construction This product is a half bridge module consisting of SiC-UMOSFET and SiC-SBD from ROHM. Dimensions & Pin layout (Unit : mm) 4 1 2 3 (M2.6 FOR SELF-TAPPING SCREW) www.rohm.com 2015 ROHM Co., Ltd. All rights reserved. 20.Aug.2019 - Rev.002 1/10Datasheet BSM180D12P3C007 Absolute maximum ratings (T = 25C) j Parameter Conditions Limit Symbol Unit Drain-source voltage V G-S short 1200 DSS 22 Gate-source voltage() V V GSS Gate-source voltage() D-S short 4 G - S Voltage (t <300ns) V -4 to 26 surge GSSsurge I DC (T =60C) 180 D c 1 Drain current * 2 I 360 Pulse (T =60C) 1ms * DRM c I DC (T =60C) V =18V 180 A S c GS 1 2 360 Source current * Pulse (T =60C) 1ms V =18V* c GS I SRM 2 Pulse (T =60C) 10s V =0V * 360 c GS 3 Ptot T =25C 880 W Total power disspation * c T 175 Max Junction Temperature jmax Junction temperature T 40 to150 C jop Storage temperature T 40 to125 stg Terminals to baseplate, 4 Visol 2500 Vrms Isolation voltage * f=60Hz AC 1min. Main Terminals : M6 screw 4.5 Mounting torque N m Mounting to heat shink : M5 screw 3.5 (*1) Case temperature (T ) is defined on the surface of base plate just under the chips. c (*2) Repetition rate should be kept within the range where temperature rise if die should not exceed T jmax. (*3) T is less than 175C j Example of acceptable V waveform GS +26V tsurge +22V -4V www.rohm.com 2015 ROHM Co., Ltd. All rights reserved. 20.Aug.2019 - Rev.002 2/10

Tariff Desc

8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
RHE
RHM
ROHM Semicon
ROHM Semiconductor
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