X-On Electronics has gained recognition as a prominent supplier of BSM300C12P3E301 Discrete Semiconductor Modules across the USA, India, Europe, Australia, and various other global locations. BSM300C12P3E301 Discrete Semiconductor Modules are a product manufactured by ROHM. We provide cost-effective solutions for Discrete Semiconductor Modules, ensuring timely deliveries around the world.

BSM300C12P3E301 ROHM

BSM300C12P3E301 electronic component of ROHM
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Part No.BSM300C12P3E301
Manufacturer: ROHM
Category: Discrete Semiconductor Modules
Description: Discrete Semiconductor Modules SIC Pwr Module Chopper
Datasheet: BSM300C12P3E301 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 942.8541 ea
Line Total: USD 942.85 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 27 Dec to Thu. 02 Jan
MOQ : 1
Multiples : 1
1 : USD 1108.1922

0
Ship by Wed. 25 Dec to Fri. 27 Dec
MOQ : 1
Multiples : 1
1 : USD 942.8541

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Product
Type
Vf - Forward Voltage
Vr - Reverse Voltage
Vgs - Gate-Source Voltage
Mounting Style
Minimum Operating Temperature
Maximum Operating Temperature
Packaging
Configuration
Brand
Transistor Polarity
Fall Time
Id - Continuous Drain Current
Pd - Power Dissipation
Product Type
Rise Time
Factory Pack Quantity :
Subcategory
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Vds - Drain-Source Breakdown Voltage
Vgs Th - Gate-Source Threshold Voltage
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We are delighted to provide the BSM300C12P3E301 from our Discrete Semiconductor Modules category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BSM300C12P3E301 and other electronic components in the Discrete Semiconductor Modules category and beyond.

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SiC Power Module Datasheet BSM300C12P3E301 Application Circuit diagram Converter 1 7 9 8 3,4 6 (N .C ) Features 5 1) Low surge, low switching loss. 10 1TC 2) High-speed switching possible. 2 11 Do not connect anything to NC pin. 3) Reduced temperature dependence. Construction This product is a chopper module consisting of SiC-UMOSFET and SiC-SBD from ROHM. Dimensions & Pin layout (Unit : mm) www.rohm.com 1/10 22.Feb.2019 - Rev.001 2019 ROHM Co., Ltd. All rights reserved. BSM300C12P3E301 Datasheet Absolute maximum ratings (T = 25C) j Symbol Parameter Conditions Ratings Unit V G-S short 1200 Drain - Source Voltage DSS V Repetitive Reverse Voltage Clamp diode 1200 RRM V Gate - Source Voltage (+) D-S short 22 V GSS V D-S short Gate - Source Voltage (-) -4 GSS G - S Voltage (t <300nsec) V D-S short GSSsurge -4 to 26 surge I DC(Tc=60C) VGS=18V 288 D I Drain Current DC (Tc = 50 300 D Note 1) I Pulse (Tc = 60C 1ms VGS=18V 600 DRM Note 2) I DC(Tc=60C) VGS=18V 288 S I DC(Tc=50C) VGS=18V 300 A S Source Current Note 1) I Pulse (Tc = 60C 1ms VGS=18V 600 SRM Note 2) I Pulse (Tc = 60C 10s VGS=0V SRM 600 Note 2) I DC(Tc = 60 ) 300 F Forward Current (clamp diode) Note 1) I Pulse (Tc = 60 1ms 600 FRM Note 2 Total Power Dissipation Ptot Tc = 25C 1360 W Note 3) Max Junction Temperature Tjmax 175 Tjop Junction Temperature -40 to 150 C Tstg Storage Temperature -40 to 125 Visol Terminals to baseplate f = 60Hz AC 1 min. 2500 Vrms Isolation Voltage Main Terminals : M6 screw 4.5 - Mounting Torque N m Mounting to heat sink M5 screw 3.5 Note 1) Case temperature (Tc) is defined on the surface of base plate just under the chips. Note 2) Repetition rate should be kept within the range where temperature rise if die should not exceed Tjmax. Note 3) Tj is less than 175C. Example of acceptable VGS waveform +26V t s u r g e +22V -4V www.rohm.com 22.Feb.2019 - Rev.001 2019 ROHM Co., Ltd. All rights reserved. 2/10

Tariff Desc

8541.30.00 20 No - Thyristors, diacs and triacs, other than photo- sensitive devices Free
RHE
RHM
ROHM Semicon
ROHM Semiconductor
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