X-On Electronics has gained recognition as a prominent supplier of TSM60NB190CI MOSFETs across the USA, India, Europe, Australia, and various other global locations. TSM60NB190CI MOSFETs are a product manufactured by Taiwan Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

TSM60NB190CI Taiwan Semiconductor

TSM60NB190CI electronic component of Taiwan Semiconductor
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See Product Specifications
Part No.TSM60NB190CI
Manufacturer: Taiwan Semiconductor
Category: MOSFETs
Description: MOSFET 600V Power MOSFET Superjunction N-chan
Datasheet: TSM60NB190CI Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
4000: USD 1.32 ea
Line Total: USD 5280 
Availability - 0
MOQ: 4000  Multiples: 4000
Pack Size: 4000
Availability Price Quantity
0
Ship by Thu. 26 Dec to Mon. 30 Dec
MOQ : 4000
Multiples : 4000
4000 : USD 1.32
5000 : USD 1.298
10000 : USD 1.265

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Brand
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the TSM60NB190CI from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the TSM60NB190CI and other electronic components in the MOSFETs category and beyond.

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TSM60NB190CI TSM60NB190CZ Taiwan Semiconductor N-Channel Power MOSFET 600V, 18A, 0.19 FEATURES KEY PERFORMANCE PARAMETERS Super-Junction technology PARAMETER VALUE UNIT High performance, small R *Q figure of merit (FOM) DS(ON) g V 600 V DS High ruggedness performance R (max) 0.19 DS(on) 100% UIS tested Q g 31 nC High commutation performance Pb-free plating Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC Halogen-free according to IEC 61249-2-21 APPLICATIONS Power Supply AC/DC LED Lighting ITO-220 TO-220 ABSOLUTE MAXIMUM RATINGS (T = 25C unless otherwise noted) A PARAMETER SYMBOL ITO-220 TO-220 UNIT Drain-Source Voltage V 600 V DS Gate-Source Voltage V 30 V GS T = 25C 18 A C (Note 1) Continuous Drain Current I D T = 100C 10.8 A C (Note 2) Pulsed Drain Current I 54 A DM Total Power Dissipation T = 25C P 33.8 150.6 W C DTOT (Note 3) Single Pulsed Avalanche Energy E 212.9 mJ AS (Note 3) Single Pulsed Avalanche Current I 2.6 A AS Operating Junction and Storage Temperature Range T , T - 55 to +150 C J STG THERMAL PERFORMANCE PARAMETER SYMBOL ITO-220 TO-220 UNIT Junction to Case Thermal Resistance R 3.7 0.83 C/W JC Junction to Ambient Thermal Resistance R 62 C/W JA Notes: R is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined JA at the solder mounting surface of the drain pins. R is guaranteed by design while R is determined by the users board JA CA design. R shown below for single device operation on FR-4 PCB with minimum recommended footprint in still air. JA 1 Version: D1608 TSM60NB190CI TSM60NB190CZ Taiwan Semiconductor ELECTRICAL SPECIFICATIONS (T = 25C unless otherwise noted) A PARAMETER CONDITIONS SYMBOL MIN TYP MAX UNIT Static Drain-Source Breakdown Voltage V = 0V, I = 250A BV 600 -- -- GS D DSS V Gate Threshold Voltage V = V , I = 250A V 2.0 3.0 4.0 V DS GS D GS(TH) Gate Body Leakage V = 30V, V = 0V I -- -- 100 GS DS GSS nA Zero Gate Voltage Drain Current V = 600V, V = 0V I -- -- 1 A DS GS DSS Drain-Source On-State Resistance V = 10V, I = 6A R -- 0.17 0.19 GS D DS(on) (Note 4) (Note 5) Dynamic Total Gate Charge Q -- 31 -- g V = 380V, I = 18A, DS D Gate-Source Charge Q -- 8 -- gs nC V = 10V GS Gate-Drain Charge Q -- 12.6 -- gd Input Capacitance C -- 1273 -- iss V = 100V, V = 0V, DS GS pF Output Capacitance f = 1.0MHz C -- 92 -- oss Gate Resistance F = 1MHz, open drain R -- 3.1 -- g (Note 6) Switching Turn-On Delay Time t -- 36 -- d(on) V = 380V, DD Turn-On Rise Time t -- 21 -- r R = 25, ns GEN Turn-Off Delay Time t -- 95 -- d(off) I = 18A, V = 10V, D GS Turn-Off Fall Time t -- 21 -- f Source-Drain Diode (Note 4) Forward On Voltage -- -- 1.4 V I = 18A, V = 0V V S GS SD Reverse Recovery Time -- 359.4 -- ns t rr V =100V, I = 18A R S Reverse Recovery Charge -- 4.54 -- C dI /dt = 100A/s Q F rr Notes: 1. Current limited by package. 2. Pulse width limited by the maximum junction temperature. o 3. L = 63mH, I = 2.6A, V = 50V, R = 25, Starting T = 25 C AS DD G J 4. Pulse test: PW 300s, duty cycle 2%. 5. For DESIGN AID ONLY, not subject to production testing. 6. Switching time is essentially independent of operating temperature. ORDERING INFORMATION PART NO. PACKAGE PACKING TSM60NB190CI C0G ITO-220 50pcs / Tube TSM60NB190CZ C0G TO-220 50pcs / Tube 2 Version: D1608

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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