SiS990DN Vishay Siliconix Dual N-Channel 100 V (D-S) MOSFET FEATURES PRODUCT SUMMARY TrenchFET Power MOSFET f V (V) R () (Max.) I (A) Q (Typ.) DS DS(on) D g 100 % R and UIS Tested g Material categorization: 0.085 at V = 10 V 12.1 GS For definitions of compliance please see 100 0.090 at V = 7.5 V 11.8 3.3 nC GS www.vishay.com/doc 99912 0.105 at V = 6 V 10.9 GS APPLICATIONS PowerPAK 1212-8 DC/DC Conversion Primary side switch Synchronous Rectification S1 3.30 mm 3.30 mm 1 Industrial G1 2 48 V Battery Monitoring S2 3 G2 LED Driver 4 D D 1 2 D1 8 D1 7 D2 6 D2 5 G G 1 2 Bottom View Ordering Information: N-Channel MOSFET N-Channel MOSFET SiS990DN-T1-GE3 (Lead (Pb)-free and Halogen-free) S S 1 2 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) A Parameter Symbol Limit Unit V Drain-Source Voltage 100 DS V V Gate-Source Voltage 20 GS T = 25 C 12.1 C T = 70 C 9.7 C Continuous Drain Current (T = 150 C) I J D a, b T = 25 C 4.1 A a, b T = 70 C 3.2 A A Pulsed Drain Current (t = 300 s) I 20 DM T = 25 C 20 C Continuous Source-Drain Diode Current I S a, b T = 25 C 2.3 A Single Pulse Avalanche Current I 7 AS L = 0.1 mH Single Pulse Avalanche Energy E 2.5 mJ AS T = 25 C 25 C T = 70 C 16 C Maximum Power Dissipation P W D a, b T = 25 C 2.8 A a, b T = 70 C 1.8 A T , T Operating Junction and Storage Temperature Range - 55 to 150 J stg C c, d Soldering Recommendations (Peak Temperature) 260 THERMAL RESISTANCE RATINGS Parameter Symbol TypicalMaximumUnit a, e Maximum Junction-to-Ambient t 10 s R 35 44 thJA C/W R Maximum Junction-to-Case (Drain) Steady State 45 thJC Notes: a. Surface mounted on 1 x 1 FR4 board. b. t = 10 s. c. See solder profile (www.vishay.com/doc 73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components. e. Maximum under steady state conditions is 94 C/W. f. Based on T = 25 C. C Document Number: 62903 For technical questions, contact: pmostechsupport vishay.com www.vishay.com S13-1823-Rev. A, 12-Aug-13 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000SiS990DN Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) J Parameter Symbol Test Conditions Min.Typ.Max.Unit Static Drain-Source Breakdown Voltage V V = 0 V, I = 250 A 100 V DS GS D V Temperature Coefficient V /T 61 DS DS J I = 250 A mV/C D V Temperature Coefficient V /T - 6.2 GS(th) GS(th) J Gate-Source Threshold Voltage V V = V , I = 250 A 2.5 4 V GS(th) DS GS D Gate-Source Leakage I V = 0 V, V = 20 V 100 nA GSS DS GS V = 100 V, V = 0 V 1 DS GS Zero Gate Voltage Drain Current I A DSS V = 100 V, V = 0 V, T = 55 C 10 DS GS J a On-State Drain Current I V 5 V, V = 10 V 8 A D(on) DS GS V 10 V, I = 8 A 0.071 0.085 GS D a Drain-Source On-State Resistance R V 7.5 V, I = 6 A 0.076 0.091 DS(on) GS D V 6 V, I = 4 A 0.086 0.105 GS D a Forward Transconductance g V = 15 V, I = 8 A 11 S fs DS D b Dynamic Input Capacitance C 250 iss Output Capacitance C 73V = 50 V, V = 0 V, f = 1 MHz pF oss DS GS Reverse Transfer Capacitance C 7 rss V = 50 V, V = 10 V, I = 10 A 5.2 8 DS GS D Total Gate Charge Q V = 50 V, V = 7.5 V, I = 10 A 4 6 g DS GS D 3.3 5 nC V = 50 V, V = 6 V, I = 10 A Gate-Source Charge Q 1.4 DS GS D gs Gate-Drain Charge Q 1.5 gd Output Charge Q V = 50 V, V = 0 V 7 11 oss DS GS R Gate Resistance f = 1 MHz 1 3.1 5 g Turn-On Delay Time t 816 d(on) Rise Time t 816 r V = 50 V, R = 5 DD L I 10 A, V = 7.5 V, R = 1 t Turn-Off Delay Time D GEN g 816 d(off) Fall Time t 612 f ns t Turn-On Delay Time 714 d(on) Rise Time t 714 r V = 50 V, R = 5 DD L I 10 A, V = 10 V, R = 1 Turn-Off Delay Time t D GEN g 816 d(off) Fall Time t 510 f Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current I T = 25 C 20 S C A Pulse Diode Forward Current I 20 SM Body Diode Voltage V I = 4 A, V 0 V 0.87 1.2 V SD S GS Body Diode Reverse Recovery Time t 30 60 ns rr Body Diode Reverse Recovery Charge Q 27 54 nC rr I = 5 A, dI/dt = 100 A/s, T = 25 C F J Reverse Recovery Fall Time t 16 a ns Reverse Recovery Rise Time t 14 b Notes: a. Pulse test pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com For technical questions, contact: pmostechsupport vishay.com Document Number: 62903 2 S13-1823-Rev. A, 12-Aug-13 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000