ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided as-is and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. HUF76633P3 -F085 Data Sheet April 2012 38A, 100V, 0.036 Ohm, N-Channel, Logic Level UltraFET Power MOSFET Packaging Features JEDEC TO-220AB Ultra Low On-Resistance -r = 0.035, V = 10V DS(ON) GS SOURCE DRAIN -r = 0.036, V = 5V DS(ON) GS GATE Simulation Models - Temperature Compensated PSPICE and SABER Electrical Models - Spice and SABER Thermal Impedance Models DRAIN Peak Current vs Pulse Width Curve (FLANGE) UIS Rating Curve Switching Time vs R Curves GS Symbol Qualified to AEC Q101 D RoHS Compliant G Ordering Information S PART NUMBER PACKAGE BRAND HUF76633P3-F085 TO-220AB 76633P o Absolute Maximum Ratings T = 25 C, Unless Otherwise Specified C Ratings Units Drain to Source Voltage (Note 1) . V 100 V DSS Drain to Gate Voltage (R = 20k ) (Note 1) . V 100 V GS DGR Gate to Source Voltage . V 16 V GS Drain Current o Continuous (T = 25 C, V = 5V) I 38 A C GS D o Continuous (T = 25 C, V = 10V) (Figure 2) . I 39 A C GS D o Continuous (T = 100 C, V = 5V) . I 27 A C GS D o Continuous (T = 100 C, V = 4.5V) (Figure 2) . I 27 A C GS D Pulsed Drain Current . I Figure 4 DM Pulsed Avalanche Rating UIS Figures 6, 17, 18 Power Dissipation P 145 W D o o Derate Above 25 C 0.97 W/ C o Operating and Storage Temperature . T , T -55 to 175 C J STG Maximum Temperature for Soldering o Leads at 0.063in (1.6mm) from Case for 10s T 300 C L o Package Body for 10s, See Techbrief TB334 . T 260 C pkg NOTES: o o 1. T = 25 C to 150 C. J CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. All ON semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification. 2012 Semiconductor Components Industries, LLC. 1 Publication Order Number: September-2017, Rev. 3 HUF76633P3-F085/D