X-On Electronics has gained recognition as a prominent supplier of MTW32N20EG MOSFET across the USA, India, Europe, Australia, and various other global locations. MTW32N20EG MOSFET are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFET, ensuring timely deliveries around the world.

MTW32N20EG ON Semiconductor

MTW32N20EG electronic component of ON Semiconductor
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See Product Specifications
Part No.MTW32N20EG
Manufacturer: ON Semiconductor
Category: MOSFET
Description: MOSFET NFET T0247 200V 32A 75mOhm
Datasheet: MTW32N20EG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 8.45 ea
Line Total: USD 8.45

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Tue. 30 Jul to Mon. 05 Aug
MOQ : 1
Multiples : 1
1 : USD 8.45
10 : USD 7.8343
50 : USD 6.5548
100 : USD 6.084

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs - Gate-Source Breakdown Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Channel Mode
Configuration
Brand
Forward Transconductance - Min
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the MTW32N20EG from our MOSFET category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MTW32N20EG and other electronic components in the MOSFET category and beyond.

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MTW32N20E Power MOSFET 32 Amps, 200 Volts N Channel TO247 This advanced Power MOSFET is designed to withstand high MTW32N20E ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS DrainSource Breakdown Voltage V (BR)DSS 200 Vdc (V = 0 V, I = 250 Adc) GS D Temperature Coefficient (Positive) 247 mV/C Zero Gate Voltage Drain Current I Adc DSS (V = 200 Vdc, V = 0) 250 DS GS (V = 200 Vdc, V = 0, T = 125C) 1000 DS GS J GateBody Leakage Current (V = 20 Vdc, V = 0) I 100 nAdc GS DS GSS ON CHARACTERISTICS (Note 1) Gate Threshold Voltage V GS(th) (V = V , I = 250 Adc) 2.0 4.0 Vdc DS GS D Temperature Coefficient (Negative) 8.0 mV/C Static DrainSource OnResistance (V = 10 Vdc, I = 16 Adc) R 0.064 0.075 GS D DS(on) DrainSource OnVoltage (V = 10 Vdc) V Vdc GS DS(on) (I = 32 Adc) 3.0 D (I = 16 Adc, T = 125C) 2.7 D J Forward Transconductance (V = 15 Vdc, I = 16 Adc) g 12 mhos DS D FS DYNAMIC CHARACTERISTICS Input Capacitance C 3600 5000 pF iss Output Capacitance C 690 1000 (V = 25 Vdc, V = 0, f = 1.0 MHz) oss DS GS Reverse Transfer Capacitance C 130 250 rss SWITCHING CHARACTERISTICS (Notes 1 & 2) TurnOn Delay Time t 25 50 ns d(on) Rise Time t 120 240 r (V = 100 Vdc, I = 32 Adc, DD D V = 10 Vdc, R = 6.2 ) GS G Turn Off Delay Time t 75 150 d(off) Fall Time t 91 182 f Gate Charge Q 85 120 nC T Q 12 1 (V = 160 Vdc, I = 32 Adc, DS D V = 10 Vdc) GS Q 40 2 Q 30 3 SOURCEDRAIN DIODE CHARACTERISTICS (Note 1) Forward OnVoltage V Vdc SD (I = 32 Adc, V = 0) S GS 1.1 2.0 (I = 16 Adc, V = 0, T = 125C) S GS J 0.9 Reverse Recovery Time t 280 ns rr t 195 a (I = 32 Adc, V = 0, dI /dt = 100 A/ s) S GS S t 85 b Reverse Recovery Stored Charge Q 2.94 C RR INTERNAL PACKAGE INDUCTANCE Internal Drain Inductance L 5.0 nH D (Measured from the drain lead 0.25 from package to center of die) Internal Source Inductance L 13 nH S (Measured from the source lead 0.25 from package to source bond pad) 1. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 2. Switching characteristics are independent of operating junction temperature.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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