TLP155E(E) Toshiba

Semiconductor Catalog May 2015 Photocouplers and Photorelays SEMICONDUCTOR & STORAGE PRODUCTS Photocouplers are widely used in various electronic devices to isolate high- V SKRWRFRX RVKLED 7 VSHHG VLJQDOV IURP QRLVH VHQVLWLYH FLUFXLWV SOHUV FRQVLVW of a high-intensity infrared light-emitting diode (LED) optically coupled to a photodetector fabricated using the latest process. The LED-photodetector Infrared LED Photo detector couple is encapsulated in an electrically insulating resin with high transparency. Features of Toshiba s photocouplers include certification to many international safety standards, high isolation and low power consumption. They are suitable for applications requiring a high level of safety. Photocoupler Package DIP4 DIP6 General-purpose packages Lead-forming options for surface mounting DIP8 DIP16 DIP4 DIP6 PP FOHDUDQFH FUHHSDJH PP LVRODWLRQ WKLFNQHVV SDIP6 6 pin thin SMD package (1.27 mm lead pitch) SDIP6 DIP8 DIP16 PP FOHDUDQFH FUHHSDJH PP LVRODWLRQ WKLFNQHVV SO6 5 pin thin SMD package (1.27 mm lead pitch) SO6 PP FOHDUDQFH FUHHSDJH PP LVRODWLRQ WKLFNQHVV SO6L SO6L SLQ 60 SDFNDJH PP OHDG SLWFK SO8 SO8 SOP4 SO4 4 pin SMD package (1.27 mm lead pitch) 16 pin SMD package (1.27 mm lead pitch) SO4 SOP4 SO16 SOP16 SOP16 SO16 PP FOHDUDQFH FUHHSDJH PP LVRODWLRQ WKLFNQHVV SO16L 16 pin SMD package (1.27 mm lead pitch) SO16L SMD package (1.27 mm lead pitch) MFSOP6 MFSOP6 2.54SOP4 2.54SOP6 SMD package (2.54 mm lead pitch) 2.54SOP8 2.54SOP4 2.54SOP6 2.54SOP8 Ultra-small SMD package (1.27 mm lead pitch) SSOP4 SSOP4 Ultra-small SMD package (1.27 mm lead pitch) USOP4 USOP4 VSON4 VSON4 SMD package (Very Small Outline Non-leaded) 2