Si4942DY Vishay Siliconix Dual N-Channel 40-V (D-S) MOSFET FEATURES PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 V (V) R ()I (A) DS DS(on) D Definition 0.021 at V = 10 V 7.4 GS TrenchFET Power MOSFET 40 0.028 at V = 4.5 V 6.4 GS Compliant to RoHS Directive 2002/95/EC APPLICATIONS Low Power Synchronous Rectifier Automotive 12 V Systems D D 1 2 SO-8 S D 1 1 8 1 G D 1 2 7 1 S D 3 6 2 2 G G 1 2 G D 2 4 5 2 T op V i e w S S Ordering Information: Si4942DY-T1-E3 (Lead (Pb)-free) 1 2 Si4942DY-T1-GE3 (Lead (Pb)-free and Halogen-free) N-Channel MOSFET N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS T = 25 C, unless otherwise noted A Parameter Symbol 10 sSteady State Unit V Drain-Source Voltage 40 DS V V Gate-Source Voltage 20 GS T = 25 C 7.4 5.3 A a I Continuous Drain Current (T = 150 C) D J T = 70 C 5.8 4.3 A I Pulsed Drain Current 30 A DM Avalanche Current L = 0.1 mH I 25 AS a I 1.8 0.9 Continuous Source Current (Diode Conduction) S T = 25 C 2.1 1.1 A a P W Maximum Power Dissipation D T = 70 C 1.3 0.7 A T , T Operating Junction and Storage Temperature Range - 55 to 150 C J stg THERMAL RESISTANCE RATINGS Parameter Symbol TypicalMaximumUnit t 10 s 50 60 a R Maximum Junction-to-Ambient thJA Steady State 90 110 C/W R Maximum Junction-to-Foot (Drain) Steady State 28 34 thJF Notes: a. Surface Mounted on 1 x 1 FR4 board. Document Number: 71887 www.vishay.com S09-0704-Rev. D, 27-Apr-09 1Si4942DY Vishay Siliconix SPECIFICATIONS T = 25 C, unless otherwise noted J Parameter Symbol Test Conditions Min.Typ.Max.Unit Static V V = V , I = 250 A Gate Threshold Voltage 1.0 3 V GS(th) DS GS D I V = 0 V, V = 20 V Gate-Body Leakage 100 nA GSS DS GS V = 40 V, V = 0 V 1 DS GS I Zero Gate Voltage Drain Current A DSS V = 40 V, V = 0 V, T = 55 C 5 DS GS J a I V 5 V, V = 10 V 30 A On-State Drain Current D(on) DS GS V = 10 V, I = 7.4 A 0.017 0.021 GS D a R Drain-Source On-State Resistance DS(on) V = 4.5 V, I = 6.4 A 0.023 0.028 GS D a g V = 15 V, I = 7.4 A 25 S Forward Transconductance fs DS D a V I = 1.8 A, V = 0 V 0.75 1.1 V Diode Forward Voltage SD S GS b Dynamic Total Gate Charge Q 21 32 g Q V = 20 V, V = 10 V, I = 5.7 A Gate-Source Charge 3.3 nC gs DS GS D Gate-Drain Charge Q 5.8 gd R Gate Resistance 0.5 1.1 1.6 g Turn-On Delay Time t 13 20 d(on) t Rise Time V = 20 V, R = 20 10 15 r DD L I 1 A, V = 10 V, R = 6 Turn-Off Delay Time t 31 50 ns D GEN g d(off) t Fall Time 11 20 f Source-Drain Reverse Recovery Time t I = 1.8 A, dI/dt = 100 A/s 30 60 rr F Notes: a. Pulse test pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TYPICAL CHARACTERISTICS 25 C unless otherwise noted 30 30 V = 10 thru 5 V GS 25 4 V 25 20 20 15 15 10 10 T = 125 C C 5 5 25 C 3 V - 55 C 0 0 0 1234 5 0 1234 5 V - Drain-to-Source Voltage (V) DS V - Gate-to-Source Voltage (V) GS Output Characteristics Transfer Characteristics www.vishay.com Document Number: 71887 2 S09-0704-Rev. D, 27-Apr-09 I - Drain Current (A) D I - Drain Current (A) D