Si5908DC Vishay Siliconix Dual N-Channel 20 V (D-S) MOSFET FEATURES PRODUCT SUMMARY Halogen-free According to IEC 61249-2-21 V (V) R ( )I (A) DS DS(on) D Definition 0.040 at V = 4.5 V 5.9 TrenchFET Power MOSFETs GS Ultra Low R and Excellent Power 20 0.045 at V = 2.5 V 5.6 DS(on) GS Handling in Compact Footprint 0.052 at V = 1.8 V 5.2 GS Compliant to RoHS Directive 2002/95/EC APPLICATIONS Load Switch PA Switch 1206-8 ChipFET Battery Switch D D 1 2 1 S 1 D G 1 1 D S 1 2 D G 2 2 Marking Code G G 1 2 D 2 CC XXX Lot Traceability and Date Code Part Code Bottom View S S 1 2 Ordering Information: Si5908DC-T1-E3 (Lead (Pb)-free) Si5908DC-T1-GE3 (Lead (Pb)-free and Halogen-free) N-Channel MOSFET N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS T = 25 C, unless otherwise noted A Parameter Symbol 5 s Steady State Unit Drain-Source Voltage V 20 DS V V Gate-Source Voltage 8 GS T = 25 C 5.9 4.4 A a I Continuous Drain Current (T = 150 C) D J T = 85 C 4.2 3.1 A A I Pulsed Drain Current 20 DM a I 1.8 0.9 Continuous Source Current (Diode Conduction) S T = 25 C 2.1 1.1 A a P W Maximum Power Dissipation D T = 85 C 1.1 0.6 A T , T Operating Junction and Storage Temperature Range - 55 to 150 J stg C b, c 260 Soldering Recommendations (Peak Temperature) THERMAL RESISTANCE RATINGS Parameter Symbol TypicalMaximumUnit t 5 s 50 60 a R Maximum Junction-to-Ambient thJA Steady State 90 110 C/W R Maximum Junction-to-Foot (Drain) Steady State 30 40 thJF Notes: a. Surface mounted on 1 x 1 FR4 board. b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components. Document Number: 73074 www.vishay.com S10-0548-Rev. B, 08-Mar-10 1Si5908DC Vishay Siliconix SPECIFICATIONS T = 25 C, unless otherwise noted J Parameter Symbol Test Conditions Min.Typ.Max.Unit Static V V = V , I = 250 A Gate Threshold Voltage 0.4 1.0 V GS(th) DS GS D I V = 0 V, V = 8 V Gate-Body Leakage 100 nA GSS DS GS V = 20 V, V = 0 V 1 DS GS I Zero Gate Voltage Drain Current A DSS V = 20 V, V = 0 V, T = 85 C 5 DS GS J a I V 5 V, V = 4.5 V 20 A On-State Drain Current D(on) DS GS V = 4.5 V, I = 4.4 A 0.032 0.040 GS D a R V = 2.5 V, I = 4.1 A 0.036 0.045 Drain-Source On-State Resistance DS(on) GS D V = 1.8 V, I = 1.9 A 0.042 0.052 GS D a g V = 10 V, I = 4.4 A 22 S Forward Transconductance fs DS D a V I = 0.9 A, V = 0 V 0.8 1.2 V Diode Forward Voltage SD S GS b Dynamic Q Total Gate Charge 57.5 g N-Channel Gate-Source Charge Q 0.85 nC gs V = 10 V, V = 4.5 V, I = 4.4 A DS GS D Q Gate-Drain Charge 1 gd Gate Resistance R 1.9 g t Turn-On Delay Time 20 30 d(on) N-Channel Rise Time t 36 55 r V = 10 V, R = 10 DD L t Turn-Off Delay Time 30 45 ns d(off) I 1 A, V = 4.5 V, R = 6 D GEN g Fall Time t 12 20 f t I = 0.9 A, dI/dt = 100 A/s Source-Drain Reverse Recovery Time 45 90 rr F Notes: a. Pulse test pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. TYPICAL CHARACTERISTICS 25 C unless otherwise noted 20 20 V = 5 V thru 2 V GS T = - 55 C C 16 16 25 C 12 1.5 V 12 125 C 8 8 4 4 1V 0 0 0 1234 5 0.0 0.4 0.8 1.2 1.6 2.0 V - Drain-to-Source Voltage (V) DS V - Gate-to-Source Voltage (V) GS Output Characteristics Transfer Characteristics www.vishay.com Document Number: 73074 2 S10-0548-Rev. B, 08-Mar-10 I - Drain Current (A) D I - Drain Current (A) D