1.9 mm Si5922DU www.vishay.com Vishay Siliconix Dual N-Channel 30 V (D-S) MOSFET FEATURES PowerPAK ChipFET Dual TrenchFET power MOSFET D 1 D 1 8 D 100 % R and UIS tested g 2 7 D 2 6 New thermally enhanced PowerPAK 5 package ChipFET - Small footprint area 11 - Low on-resistance 22 SS 11 33 - Thin 0.8 mm profile GG 11 44 SS 11 2 G Material categorization: for definitions of compliance 2 please see www.vishay.com/doc 99912 Top View Bottom View APPLICATIONS DC/DC power supply PRODUCT SUMMARY V (V) R ( ) MAX. I (A) Q (TYP.) DS DS(on) D g D D 1 2 a 0.0192 at V = 10 V 6 GS a 30 0.0220 at V = 6 V 6 4.7 nC GS a 0.0245 at V = 4.5 V 6 GS G G 1 2 Marking Code: CG Ordering Information: N-Channel MOSFET N-Channel MOSFET Si5922DU-T1-GE3 (lead (Pb)-free and halogen-free) S S 1 2 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) A PARAMETER SYMBOL LIMITUNIT 30 Drain-Source Voltage V DS V Gate-Source Voltage V +20 / -16 GS a T = 25 C 6 C a T = 70 C 6 C Continuous Drain Current (T = 150 C) I J D a, b, c T = 25 C 6 A a, b, c T = 70 C 6 A A Pulsed Drain Current (t = 100 s) I 24 DM a T = 25 C 6 C Continuous Source-Drain Diode Current I S b, c T = 25 C 1.9 A Single Pulse Avalanche Current I 10 AS L = 0.1 mH Avalanche Energy E 5mJ AS T = 25 C 10.4 C = 70 C 6.7 T C Maximum Power Dissipation P W D b, c T = 25 C 2.3 A b, c T = 70 C 1.5 A Operating Junction and Storage Temperature Range T , T -55 to +150 J stg C d, e Soldering Recommendations (Peak Temperature) 260 THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYPICALMAXIMUMUNIT b, f Maximum Junction-to-Ambient t 5 s R 43 55 thJA C/W Maximum Junction-to-Case (Drain) Steady State R 9.5 12 thJC Notes a. Package limited. b. Surface mounted on 1 x 1 FR4 board. c. t = 5 s. d. See solder profile (www.vishay.com/ppg 73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components. f. Maximum under steady state conditions is 105 C/W. S16-1449-Rev. A, 25-Jul-16 Document Number: 76056 1 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 3.03.0 mmmmSi5922DU www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-Source Breakdown Voltage V V = 0 V, I = 250 A 30 - - V DS GS D V Temperature Coefficient V /T -14.3 - DS DS J I = 250 A mV/C D V Temperature Coefficient V /T --4.7- GS(th) GS(th) J Gate-Source Threshold Voltage V V = V , I = 250 A 1.2 - 2.2 V GS(th) DS GS D Gate-Source Leakage I V = 0 V, V = +20 V / -16 V - - 100 nA GSS DS GS V = 30 V, V = 0 V - - 1 DS GS Zero Gate Voltage Drain Current I A DSS V = 30 V, V = 0 V, T = 55 C - - 10 DS GS J a On-State Drain Current I V 5 V, V = 10 V 5 - - A D(on) DS GS V = 10 V, I = 5 A - 0.0155 0.0192 GS D a Drain-Source On-State Resistance R V = 6 V, I = 4 A - 0.0170 0.0220 DS(on) GS D V = 4.5 V, I = 4 A - 0.0190 0.0245 GS D a Forward Transconductance g V = 10 V, I = 5 A - 22 - S fs DS D b Dynamic Input Capacitance C - 765 - iss Output Capacitance C V = 15 V, V = 0 V, f = 1 MHz - 225 - pF oss DS GS Reverse Transfer Capacitance C -14- rss C /C Ratio - 0.018 0.036 - rss iss V = 15 V, V = 10 V, I = 5 A - 10 15 DS GS D Total Gate Charge Q g -4.7 7.1 Gate-Source Charge Q V = 15 V, V = 4.5 V, I = 5 A -2.2 - nC gs DS GS D Gate-Drain Charge Q -0.65- gd Output Charge Q V = 15 V, V = 0 V - 6.5 - oss DS GS Gate Resistance R f = 1 MHz 1.3 6.3 12.6 g Turn-On Delay Time t -6 15 d(on) Rise Time t -25 50 r V = 15 V, R = 3 DD L I 5 A, V = 10 V, R = 1 Turn-Off Delay Time t -1D GEN g 530 d(off) Fall Time t -10 20 f ns Turn-On Delay Time t -17 35 d(on) Rise Time t -45 90 r V = 15 V, R = 3 DD L I 5 A, V = 4.5 V, R = 1 Turn-Off Delay Time t -1D GEN g 630 d(off) Fall Time t -27 50 f Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current I T = 25 C - - 6 S C A Pulse Diode Forward Current (t = 100 s) I -- 24 SM Body Diode Voltage V I = 5 A, V = 0 V - 0.81 1.2 V SD S GS Body Diode Reverse Recovery Time t -21 40 ns rr Body Diode Reverse Recovery Charge Q -10 20 nC rr I = 5 A, dI/dt = 100 A/s, T = 25 C F J Reverse Recovery Fall Time t -12 - a ns Reverse Recovery Rise Time t -9 - b Notes a. Pulse test pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S16-1449-Rev. A, 25-Jul-16 Document Number: 76056 2 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000