X-On Electronics has gained recognition as a prominent supplier of A2I09VD015NR1 RF Amplifier across the USA, India, Europe, Australia, and various other global locations. A2I09VD015NR1 RF Amplifier are a product manufactured by NXP. We provide cost-effective solutions for RF Amplifier, ensuring timely deliveries around the world.

A2I09VD015NR1 NXP

A2I09VD015NR1 electronic component of NXP
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Part No.A2I09VD015NR1
Manufacturer: NXP
Category: RF Amplifier
Description: RF Amplifier Airfast RF LDMOS Wideband Integrated Power Amplifier 575-960 MHz 2 W Avg. 48 V
Datasheet: A2I09VD015NR1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 24.7737 ea
Line Total: USD 24.77 
Availability - 422
Ship by Mon. 23 Dec to Wed. 25 Dec
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
422
Ship by Mon. 23 Dec to Wed. 25 Dec
MOQ : 1
Multiples : 1
1 : USD 24.7737
10 : USD 23.24
25 : USD 22.1856
100 : USD 20.3963
250 : USD 19.6933
500 : USD 18.575
1000 : USD 18.575
2500 : USD 18.1703
5000 : USD 17.8507

   
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We are delighted to provide the A2I09VD015NR1 from our RF Amplifier category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the A2I09VD015NR1 and other electronic components in the RF Amplifier category and beyond.

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DocumentNumber:A2I09VD015N NXPSemiconductors Rev. 0, 06/2018 Technical Data RFLDMOSWidebandIntegrated A2I09VD015NR1 PowerAmplifiers A2I09VD015GNR1 The A2I09VD015N wideband integrated circuit is designed with on--chip matchingthatmakes itusablefrom575to960MHz. This multi--stage structure is rated for 48 to 55 V operation and covers all typical cellular base station modulation formats. 575960MHz,2WAVG.,48V AIRFASTRFLDMOSWIDEBAND 900MHz INTEGRATEDPOWERAMPLIFIERS Typical Single--Carrier W--CDMA CharacterizationPerformance: V =48Vdc,I =16mA,I =84mA,P = 2W Avg., Input DD DQ1(A+B) DQ2(A+B) out (1) Signal PAR = 9.9 dB 0.01%Probability onCCDF. G PAE ACPR ps Frequency (dB) (%) (dBc) 920 MHz 32.9 19.3 45.9 TO--270WB--15 PLASTIC 940 MHz 33.0 19.7 45.5 A2I09VD015NR1 960 MHz 32.8 19.6 44.9 Features On--chipmatching(50ohm input, DC blocked) Integratedquiescent current temperaturecompensationwith TO--270WBG--15 (2) enable/disable function PLASTIC A2I09VD015GNR1 Designedfor digital predistortionerror correctionsystems Optimizedfor Doherty applications V DS1A V 1 DS1A V 2 GS2A RF RF /V inA out1 DS2A 15 V 3 GS1A RF 4 RF /V inA out1 DS2A N.C. 5 V GS1A QuiescentCurrent N.C. 6 14 (2) N.C. V TemperatureCompensation N.C. 7 GS2A 8 N.C. V 13 RF 9 GS1B inB QuiescentCurrent RF /V out2 DS2B V 10 (2) GS1B V TemperatureCompensation GS2B V 11 GS2B V 12 DS1B RF inB RF /V (Top View) out2 DS2B Note: Exposed backside of the package is V DS1B thesourceterminalforthetransistor. Figure1.FunctionalBlockDiagram Figure2.PinConnections 1. Alldata measured in fixture with device soldered to heatsink. 2. RefertoAN1977, Quiescent Current ThermalTracking Circuit in the RFIntegrated Circuit Family,andtoAN1987, Quiescent Current Controlforthe RFIntegrated Circuit Device Family.GotoTable1.MaximumRatings Rating Symbol Value Unit Drain--Source Voltage V 0.5, +105 Vdc DSS Gate--Source Voltage V 0.5, +10 Vdc GS Operating Voltage V 55, +0 Vdc DD Storage Temperature Range T 65 to +150 C stg Case Operating Temperature Range T 40 to +150 C C (1,2) Operating Junction Temperature Range T 40 to +225 C J Input Power P 20 dBm in Table2.ThermalCharacteristics (2,3) Characteristic Symbol Value Unit ThermalResistance, Junction to Case R C/W JC Case Temperature 74C, 2 W, 940 MHz Stage1, 48Vdc, I 16mA 7.2 DQ1(A+B) Stage2, 48Vdc, I 78mA 3.1 DQ2(A+B) Table3.ESDProtectionCharacteristics TestMethodology Class Human Body Model(perJS--001--2017) 1B Charge Device Model(perJS--002--2014) C0B Table4.MoistureSensitivityLevel TestMethodology Rating PackagePeakTemperature Unit PerJESD22--A113, IPC/JEDECJ--STD--020 3 260 C 1. Continuous use at maximum temperature willaffect MTTF. 2. MTTFcalculatoravailable at

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8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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