J175"D26Z ON Semiconductor

J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 P-Channel Switch February 2014 J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 P-Channel Switch Description This device is designed for low-level analog switching sample-and-hold circuits and chopper-stabilized amplifiers. Sourced from process 88. G S SOT-23 TO-92 D Mark: 6W / 6X / 6Y DGS Note: Source & drain are interchangeable. Figure 1. J175 / J176 Device Package Figure 2. MMBFJ175 / 176 / 177 Device Package Ordering Information Part Number Marking Package Packing Method J175 D26Z J175 TO-92 3L Tape and Reel J176 D74Z J176 TO-92 3L Ammo MMBFJ175 6W SOT-23 3L Tape and Reel MMBFJ176 6X SOT-23 3L Tape and Reel MMBFJ177 6Y SOT-23 3L Tape and Reel 1997 Fairchild Semiconductor Corporation www.fairchildsemi.com J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.1.1 1 J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 P-Channel Switch (1),(2) Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera- ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi- tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The = 25C unless otherwise noted. absolute maximum ratings are stress ratings only. Values are at T A Symbol Parameter Value Unit V Drain-Gate Voltage -30 V DG V Gate-Source Voltage 30 V GS I Forward Gate Current 50 mA GF T , T Operating and Storage Junction Temperature Range -55 to + 150 C J STG Notes: 1. These ratings are based on a maximum junction temperature of 150C. 2. These are steady-state limits. Fairchild Semiconductor should be consulted on applications involving pulsed or low-duty cycle operations. (3) Thermal Characteristics Values are at T = 25C unless otherwise noted. A Max. MMBFJ175 / Symbol Parameter Unit J175 / J176 MMBFJ176 / MMBFJ177 Total Device Dissipation 350 225 mW P D Derate Above 25C2.81.8mW/C R Thermal Resistance, Junction to Case 125 C/W JC R Thermal Resistance, Junction to Ambient 357 556 C/W JA Note: 3 (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size. 3. PCB size: FR-4 76 x 114 x 1.57 mm 1997 Fairchild Semiconductor Corporation www.fairchildsemi.com J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 Rev. 1.1.1 2