X-On Electronics has gained recognition as a prominent supplier of NTD6415ANLT4G MOSFETs across the USA, India, Europe, Australia, and various other global locations. NTD6415ANLT4G MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

NTD6415ANLT4G ON Semiconductor

NTD6415ANLT4G electronic component of ON Semiconductor
NTD6415ANLT4G ON Semiconductor
NTD6415ANLT4G MOSFETs
NTD6415ANLT4G  Semiconductors

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See Product Specifications
Part No. NTD6415ANLT4G
Manufacturer: ON Semiconductor
Category: MOSFETs
Description: ON Semiconductor MOSFET 100V HD3E NCH
Datasheet: NTD6415ANLT4G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 1.639 ea
Line Total: USD 1.64 
Availability - 3838
Ship by Tue. 31 Dec to Thu. 02 Jan
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
2425
Ship by Thu. 02 Jan to Wed. 08 Jan
MOQ : 2500
Multiples : 2500
2500 : USD 1.0209

3838
Ship by Tue. 31 Dec to Thu. 02 Jan
MOQ : 1
Multiples : 1
1 : USD 1.639
10 : USD 1.32
100 : USD 1.0769
250 : USD 1.0164
500 : USD 0.9295
1000 : USD 0.8965
2500 : USD 0.8932

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Configuration
Brand
Forward Transconductance - Min
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Transistor Type
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Category
Brand Category
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the NTD6415ANLT4G from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the NTD6415ANLT4G and other electronic components in the MOSFETs category and beyond.

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MOSFET Power, N-Channel, Logic Level 100 V, 23 A, 56 m NTD6415ANL, NVD6415ANL Features Low R DS(on) www.onsemi.com 100% Avalanche Tested NVD Prefix for Automotive and Other Applications Requiring V R MAX I MAX (BR)DSS DS(on) D Unique Site and Control Change Requirements AECQ101 Qualified and PPAP Capable 56 m 4.5 V 100 V 23 A These Devices are PbFree and are RoHS Compliant 52 m 10 V MAXIMUM RATINGS (T = 25C unless otherwise noted) J D Parameter Symbol Value Unit DraintoSource Voltage V 100 V DSS GatetoSource Voltage Continuous V 20 V GS G Continuous Drain Steady T = 25C I 23 A D C Current State T = 100C 16 C S Power Dissipation Steady T = 25C P 83 W C D State 4 Pulsed Drain Current t = 10 s I 80 A p DM 2 1 Operating and Storage Temperature Range T , T 55 to C J stg 3 +175 DPAK Source Current (Body Diode) I 23 A CASE 369AA S STYLE 2 Single Pulse DraintoSource Avalanche E 79 mJ AS Energy (V = 50 Vdc, V = 10 Vdc, I = DD GS L(pk) 23 A, L = 0.3 mH, R = 25 ) G MARKING DIAGRAM Lead Temperature for Soldering T 260 C & PIN ASSIGNMENT L Purposes, 1/8 from Case for 10 Seconds 4 Drain THERMAL RESISTANCE RATINGS Parameter Symbol Max Unit JunctiontoCase (Drain) Steady State R 1.8 C/W JC 1 3 JunctiontoAmbient Steady State (Note 1) R 49 JA 2 Gate Source Stresses exceeding those listed in the Maximum Ratings table may damage the Drain device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. A = Assembly Location* 1. Surface mounted on FR4 board using 1 sq in pad size, 6415ANL = Device Code (Cu Area 1.127 sq in 2 oz including traces). Y = Year WW = Work Week G = PbFree Package * The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package, the front side assembly code may be blank. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: March, 2020 Rev. 6 NTD6415ANL/D AYWW 64 15ANLGNTD6415ANL, NVD6415ANL ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 100 V (BR)DSS GS D V = 0 V, I = 250 A, T = 40C 92 GS D J DraintoSource Breakdown Voltage V /T 115 mV/C (BR)DSS J Temperature Coefficient Zero Gate Voltage Drain Current I T = 25C 1.0 A DSS J V = 0 V, GS V = 100 V DS T = 125C 100 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 2) Gate Threshold Voltage V 1.0 2.0 V V = V , I = 250 A GS(TH) GS DS D Negative Threshold Temperature V /T 4.8 mV/C GS(TH) J Coefficient DraintoSource OnResistance R V = 4.5 V, I = 10 A 44 56 m DS(on) GS D V = 10 V, I = 10 A 43 52 GS D Forward Transconductance g V = 5.0 V, I = 10 A 24 S FS DS D CHARGES, CAPACITANCES AND GATE RESISTANCE Input Capacitance C 1024 pF ISS Output Capacitance C V = 0 V, f = 1.0 MHz, V = 25 V 156 OSS GS DS Reverse Transfer Capacitance C 70 RSS nC Total Gate Charge Q 20 G(TOT) Threshold Gate Charge Q 1.1 G(TH) V = 4.5 V, V = 80 V, I = 23 A GS DS D GatetoSource Charge Q 3.1 GS GatetoDrain Charge Q 14 GD Total Gate Charge Q V = 10 V, V = 80 V, I = 23 A 35 nC G(TOT) GS DS D SWITCHING CHARACTERISTICS (Note 3) TurnOn Delay Time t 11 ns d(on) Rise Time t 91 r V = 4.5 V, V = 80 V, GS DD I = 23 A, R = 6.1 TurnOff Delay Time t D G 40 d(off) Fall Time t 71 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.87 1.2 V SD J V = 0 V, I = 23 A GS S T = 125C 0.74 J Reverse Recovery Time t 64 ns RR Charge Time T 40 a V = 0 V, dI /dt = 100 A/ s, GS S I = 23 A S Discharge Time T 24 b Reverse Recovery Charge Q 152 nC RR 2. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 3. Switching characteristics are independent of operating junction temperatures. ORDERING INFORMATION Device Package Shipping NTD6415ANLT4G DPAK NVD6415ANLT4G 2500 / Tape & Reel (PbFree) NVD6415ANLT4GVF01 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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