NVLUS4C12NTAG ON Semiconductor

NVLUS4C12N MOSFET Power, Single N-Channel, Cool, 2.0x2.0x0.55 mm UDFN6 30 V, 10.7 A www.onsemi.com Features MOSFET Low Profile UDFN 2.0 x 2.0 x 0.55 mm for Board Space Saving with Exposed Drain Pads for Excellent Thermal Conduction V R MAX I MAX (BR)DSS DS(on) D Ultra Low R to Reduce Conduction Losses DS(on) 9 m 10 V Optimized Gate Charge to Reduce Switching Losses 12 m 4.5 V 30 V 10.7 A Low Capacitance to Minimize Driver Losses 15 m 3.7 V NV Prefix for Automotive and Other Applications Requiring Unique 19 m 3.3 V Site and Control Change Requirements AECQ101 Qualified and PPAP Capable D These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant Applications G Power Load Switch Synch DCDC Converters Wireless Charging Circuit S NCHANNEL MOSFET MAXIMUM RATINGS (T = 25C unless otherwise stated) J Parameter Symbol Value Unit S MARKING DIAGRAM Drain-to-Source Voltage V 30 V D DSS 1 UDFN6 Gate-to-Source Voltage V 20 V GS AGM ( COOL ) Continuous Drain Steady T = 25C I 10.7 A CASE 517BG D A Pin 1 Current (Note 1) State T = 85C 7.7 AG = Specific Device Code A M = Date Code t 5 s T = 25C 15.1 A = PbFree Package Power Dissipa- Steady T = 25C P 1.54 W A D (Note: Microdot may be in either location) tion (Note 1) State t 5 s T = 25C 3.1 A PIN CONNECTIONS Continuous Drain Steady T = 25C I 6.8 A A D Current (Note 2) State T = 85C 4.9 A D 1 6 D Power Dissipation (Note 2) T = 25C P 0.63 W A D D Pulsed Drain Current I 43 A t = 10 s p DM D 2 5 D MOSFET Operating Junction and Storage T , -55 to C J Temperature T 150 STG G 3 4 S Source Current (Body Diode) (Note 1) I 1.55 A S S Lead Temperature for Soldering Purposes T 260 C L (1/8 from case for 10 s) (Top View) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ORDERING INFORMATION 1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq See detailed ordering and shipping information in the package 2 oz including traces). dimensions section on page 6 of this data sheet. Semiconductor Components Industries, LLC, 2014 1 Publication Order Number: June, 2019 Rev. 0 NVLUS4C12N/DNVLUS4C12N 2. Surface-mounted on FR4 board using the minimum recommended pad size, 2 oz. Cu. www.onsemi.com 2