MMBFJ175LT1G JFET Chopper PChannel Depletion Features S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ101 Qualified and www.onsemi.com PPAP Capable These Devices are PbFree, Halogen Free/BFR Free and are RoHS 2 SOURCE Compliant MAXIMUM RATINGS 3 GATE Rating Symbol Value Unit DrainGate Voltage V 25 V DG Reverse GateSource Voltage V 25 V 1 DRAIN GS(r) THERMAL CHARACTERISTICS Characteristic Symbol Max Unit 3 SOT23 (TO236) Total Device Dissipation FR5 Board, P D (Note 1) T = 25C 225 mW CASE 318 A 1 Derate above 25C 1.8 mW/C STYLE 10 2 Thermal Resistance, JunctiontoAmbient R 556 C/W JA Junction and Storage Temperature T , T 55 to +150 C J stg Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be MARKING DIAGRAM assumed, damage may occur and reliability may be affected. 1. FR5 = 1.0 x 0.75 x 0.062 in. 6W M ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) A Characteristic Symbol Min Max Unit 1 OFF CHARACTERISTICS 6W = Device Code Gate Source Breakdown Voltage V 30 V (BR)GSS M = Date Code* (V = 0, I = 1.0 A) DS D = PbFree Package Gate Reverse Current I 1.0 nA GSS (Note: Microdot may be in either location) (V = 0 V, V = 20 V) DS GS *Date Code orientation and/or overbar may Gate Source Cutoff Voltage V 3.0 6.0 V vary depending upon manufacturing location. GS(OFF) (V = 15, I = 10 nA) DS D ON CHARACTERISTICS Zero Gate Voltage Drain Current (Note 2) I 7.0 60 mA ORDERING INFORMATION DSS (V = 0, V = 15 V) GS DS Device Package Shipping Drain Cutoff Current I 1.0 nA D(off) (V = 15 V, V = 10 V) MMBFJ175LT1G SOT23 3000 / Tape & DS GS (PbFree) Reel Drain Source On Resistance r 125 DS(on) (I = 500 A) D SMMBFJ175LT1G SOT23 3000 / Tape & (PbFree) Reel Input Capacitance C 11 iss V = 0, V = 10V DS GS pF Reverse Transfer C 5.5 For information on tape and reel specifications, f = 1.0 MHz rss Capacitance including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Product parametric performance is indicated in the Electrical Characteristics for Brochure, BRD8011/D. the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%. Semiconductor Components Industries, LLC, 1994 1 Publication Order Number: October, 2016 Rev. 7 MMBFJ175LT1/DMECHANICAL CASE OUTLINE PACKAGE DIMENSIONS SOT23 (TO236) CASE 31808 ISSUE AS DATE 30 JAN 2018 SCALE 4:1 NOTES: D 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. 0.25 MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 3 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, T H E PROTRUSIONS, OR GATE BURRS. E 1 2 MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX L A 0.89 1.00 1.11 0.035 0.039 0.044 A1 0.01 0.06 0.10 0.000 0.002 0.004 3X b L1 b 0.37 0.44 0.50 0.015 0.017 0.020 e c 0.08 0.14 0.20 0.003 0.006 0.008 VIEW C D 2.80 2.90 3.04 0.110 0.114 0.120 TOP VIEW E 1.20 1.30 1.40 0.047 0.051 0.055 e 1.78 1.90 2.04 0.070 0.075 0.080 L 0.30 0.43 0.55 0.012 0.017 0.022 0.35 0.54 0.69 0.014 0.021 0.027 L1 A HE 2.10 2.40 2.64 0.083 0.094 0.104 T 0 10 0 10 c A1 SEE VIEW C SIDE VIEW GENERIC END VIEW MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT XXXM 1 3X XXX = Specific Device Code 2.90 0.90 M = Date Code = PbFree Package *This information is generic. Please refer to 3X 0.80 0.95 device data sheet for actual part marking. PITCH PbFree indicator, G or microdot , DIMENSIONS: MILLIMETERS may or may not be present. STYLE 1 THRU 5: STYLE 6: STYLE 7: STYLE 8: CANCELLED PIN 1. BASE PIN 1. EMITTER PIN 1. ANODE 2. EMITTER 2. BASE 2. NO CONNECTION 3. COLLECTOR 3. COLLECTOR 3. CATHODE STYLE 9: STYLE 10: STYLE 11: STYLE 12: STYLE 13: STYLE 14: PIN 1. ANODE PIN 1. DRAIN PIN 1. ANODE PIN 1. CATHODE PIN 1. SOURCE PIN 1. CATHODE 2. ANODE 2. SOURCE 2. CATHODE 2. CATHODE 2. DRAIN 2. GATE 3. CATHODE 3. GATE 3. CATHODE ANODE 3. ANODE 3. GATE 3. ANODE STYLE 15: STYLE 16: STYLE 17: STYLE 18: STYLE 19: STYLE 20: PIN 1. GATE PIN 1. ANODE PIN 1. NO CONNECTION PIN 1. NO CONNECTION PIN 1. CATHODE PIN 1. CATHODE 2. CATHODE 2. CATHODE 2. ANODE 2. CATHODE 2. ANODE 2. ANODE 3. ANODE 3. CATHODE 3. CATHODE 3. ANODE 3. CATHODE ANODE 3. GATE STYLE 21: STYLE 22: STYLE 23: STYLE 24: STYLE 25: STYLE 26: PIN 1. GATE PIN 1. RETURN PIN 1. ANODE PIN 1. GATE PIN 1. ANODE PIN 1. CATHODE 2. SOURCE 2. OUTPUT 2. ANODE 2. DRAIN 2. CATHODE 2. ANODE 3. SOURCE 3. GATE 3. NO CONNECTION 3. DRAIN 3. INPUT 3. CATHODE STYLE 27: STYLE 28: PIN 1. CATHODE PIN 1. ANODE 2. CATHODE 2. ANODE 3. CATHODE 3. ANODE Electronic versions are uncontrolled except when accessed directly from the Document Repository. DOCUMENT NUMBER: 98ASB42226B Printed versions are uncontrolled except when stamped CONTROLLED COPY in red. DESCRIPTION: SOT23 (TO236) PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. Semiconductor Components Industries, LLC, 2019 www.onsemi.com