Si3429EDV www.vishay.com Vishay Siliconix P-Channel 20 V (D-S) MOSFET FEATURES PRODUCT SUMMARY TrenchFET power MOSFET a, e V (V) R () MAX. I (A) Q (TYP.) DS DS(on) D g 100 % R tested g 0.0210 at V = -4.5 V -8 GS Built-in ESD protection -20 0.0240 at V = -2.5 V -8 43.2 nC GS 0.0380 at V = -1.8 V -8 - Typical ESD performance 3000 V GS Material categorization: For definitions of TSOP-6 Single compliance please see www.vishay.com/doc 99912 S 4 APPLICATIONS D S 5 Power management for portable D 6 and consumer - Load switches - DC/DC converters 3 G G 2 D 1 D D Top View P-Channel MOSFET Marking Code: BM Ordering Information: Si3429EDV-T1-GE3 (lead (Pb)-free and halogen-free) ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) A PARAMETER SYMBOL LIMITUNIT Drain-Source Voltage V -20 DS V Gate-Source Voltage V 8 GS e T = 25 C -8 C e T = 70 C -8 C Continuous Drain Current (T = 150 C) I J D b, c, e T = 25 C -8 A b, c T = 70 C -6.4 A A Pulsed Drain Current (t = 300 s) I -40 DM T = 25 C -3.5 C Continuous Source-Drain Diode Current I S b, c T = 25 C -1.7 A T = 25 C 4.2 C T = 70 C 2.7 C Maximum Power Dissipation P W D b, c T = 25 C 2 A b, c T = 70 C 1.3 A Operating Junction and Storage Temperature Range T , T -55 to 150 C J stg THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYPICALMAXIMUMUNIT b, d Maximum Junction-to-Ambient t 5 s R 45 62.5 thJA C/W Maximum Junction-to-Foot (Drain) Steady State R 25 30 thJF Notes a. T = 25 C. C b. Surface mounted on 1 x 1 FR4 board. c. t = 5 s. d. Maximum under steady state conditions is 110 C/W. e. Package limited. S14-0913-Rev. A, 28-Apr-14 Document Number: 62946 1 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000Si3429EDV www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-Source Breakdown Voltage V V = 0 V, I = -250 A -20 - - V DS GS D V Temperature Coefficient V /T --12 - DS DS J I = -250 A mV/C D V Temperature Coefficient V /T -2.4 - GS(th) GS(th) J Gate-Source Threshold Voltage V V = V , I = -250 A -0.4 - -1 V GS(th) DS GS D V = 0 V, V = 8 V - - 10 DS GS Gate-Source Leakage I GSS V = 0 V, V = 4.5 V - - 1 DS GS A V = -20 V, V = 0 V - - -1 DS GS Zero Gate Voltage Drain Current I DSS V = -20 V, V = 0 V, T = 55 C - - -10 DS GS J a On-State Drain Current I V -5 V, V = -4.5 V -15 - - A D(on) DS GS V = -4.5 V, I = -4 A - 0.0175 0.0210 GS D a Drain-Source On-State Resistance R V = -2.5 V, I = -4 A - 0.0200 0.0240 DS(on) GS D V = -1.8 V, I = -2 A - 0.0250 0.0380 GS D b Dynamic Input Capacitance C - 4083 - iss Output Capacitance C V = -10 V, V = 0 V, f = 1 MHz - 395 - pF oss DS GS Reverse Transfer Capacitance C - 365 - rss V = -10 V, V = -8 V, I = -8 A - 78.2 118 DS GS D Total Gate Charge Q g - 43.2 65 nC Gate-Source Charge Q V = -10 V, V = -4.5 V, I = -8 A -6.3 - gs DS GS D Gate-Drain Charge Q -4.3 - gd Gate Resistance R f = 1 MHz 1.8 9.4 18.8 g Turn-On Delay Time t -35 53 d(on) Rise Time t -30 45 r V = -10 V, R = 1.56 DD L I -6.4 A, V = -4.5 V, R = 1 D GEN g Turn-Off Delay Time t -174261 d(off) Fall Time t -58 87 f ns Turn-On Delay Time t -10 20 d(on) Rise Time t -17 26 r V = -10 V, R = 1.56 DD L I -6.4 A, V = -8 V, R = 1 D GEN g Turn-Off Delay Time t -210315 d(off) Fall Time t -64 96 f Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current I T = 25 C - - -3.5 S C A Pulse Diode Forward Current I -- -40 SM Body Diode Voltage V I = -6.4 A, V = 0 V - -0.8 -1.2 V SD S GS Body Diode Reverse Recovery Time t -28 42 ns rr Body Diode Reverse Recovery Charge Q -16 24 nC rr I = -6.4 A, dI/dt = 100 A/s, T = 25 C F J Reverse Recovery Fall Time t -13 - a ns Reverse Recovery Rise Time t -15 - b Notes a. Pulse test pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S14-0913-Rev. A, 28-Apr-14 Document Number: 62946 2 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000