8 mm8 mm SQJQ900E www.vishay.com Vishay Siliconix Automotive Dual N-Channel 40 V (D-S) 175 C MOSFET FEATURES PowerPAK 8 x 8L Dual TrenchFET power MOSFET AEC-Q101 qualified D 1 100 % R and UIS tested g Fully lead (Pb)-free device D 2 Material categorization: 1 for definitions of compliance please see G 2 1 www.vishay.com/doc 99912 S 3 1 S 11 4 2 G 2 D 1 Top View Bottom View D 2 PRODUCT SUMMARY V (V) 40 DS G 1 G 2 R ( ) at V = 10 V 0.0039 DS(on) GS R ( ) at V = 4.5 V 0.0047 DS(on) GS I (A) per leg 100 D S 1 S 2 N-Channel MOSFET N-Channel MOSFET Configuration Dual Package PowerPAK 8 x 8L ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOLLIMITUNIT Drain-source voltage V 40 DS V Gate-source voltage V 20 GS a T = 25 C 100 C Continuous drain current I D T = 125 C 60 C a Continuous source current (diode conduction) I 68 A S b Pulsed drain current I 400 DM Single pulse avalanche current I 50 AS L = 0.1 mH Single pulse avalanche energy E 125 mJ AS T = 25 C 75 C b Maximum power dissipation P W D T = 125 C 25 C Operating junction and storage temperature range T , T -55 to +175 J stg C d, e Soldering recommendations (peak temperature) 260 THERMAL RESISTANCE RATINGS PARAMETER SYMBOLLIMITUNIT c Junction-to-ambient PCB mount R 80 thJA C/W Junction-to-case (drain) R 2 thJC Notes a. Package limited b. Pulse test pulse width 300 s, duty cycle 2 % c. When mounted on 1 square PCB (FR4 material) d. See solder profile (www.vishay.com/doc 73257). The PowerPAK 8 x 8L is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components S17-0486-Rev. B, 03-Apr-17 Document Number: 62796 1 For technical questions, contact: automostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 8.1 mm8.1 mmSQJQ900E www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) C PARAMETER SYMBOLTEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-source breakdown voltage V V = 0, I = 250 A 40 - - DS GS D V Gate-source threshold voltage V V = V , I = 250 A 1.5 2 2.5 GS(th) DS GS D Gate-source leakage I V = 0 V, V = 20 V - - 100 nA GSS DS GS V = 0 V V = 20 V - - 1 GS DS Zero gate voltage drain current I V = 0 V V = 40 V, T = 125 C - - 50 A DSS GS DS J V = 0 V V = 40 V, T = 175 C - - 150 GS DS J a On-state drain current I V = 10 V V 5 V 40 - - A D(on) GS DS V = 10 V I = 20 A - 0.0034 0.0039 GS D V = 4.5 V I = 10 A - 0.0039 0.0047 GS D a Drain-source on-state resistance R DS(on) V = 10 V I = 20 A, T = 125 C - - 0.0074 GS D J V = 10 V I = 20 A, T = 175 C - - 0.0091 GS D J b Forward transconductance g V = 15 V, I = 15 A - 105 - S fs DS D b Dynamic Input capacitance C - 4695 5900 iss Output capacitance C -V = 0 V V = 20 V, f = 1 MHz637800 pF oss GS DS Reverse transfer capacitance C -259330 rss c Total gate charge Q -85 120 g c Gate-source charge Q -1V = 10 V V = 20 V, I = 40 A0- nC gs GS DS D c Gate-drain charge Q -12- gd Gate resistance R f = 1 MHz 0.7 1.5 3.0 g c Turn-on delay time t -14 30 d(on) c Rise time t -7.5 15 r V = 20 V, R = 0.5 DD L ns I 40 A, V = 10 V, R = 1 c D GEN g Turn-off delay time t -3060 d(off) c Fall time t -1430 f b Source-Drain Diode Ratings and Characteristics a Pulsed current I -- 200 A SM Forward voltage V I = 40 A, V = 0 - 1 1.2 V SD F GS Notes a. Pulse test pulse width 300 s, duty cycle 2 % b. Guaranteed by design, not subject to production testing c. Independent of operating temperature Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S17-0486-Rev. B, 03-Apr-17 Document Number: 62796 2 For technical questions, contact: automostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000