X-On Electronics has gained recognition as a prominent supplier of MRF7S21080HSR3 RF MOSFET Transistors across the USA, India, Europe, Australia, and various other global locations. MRF7S21080HSR3 RF MOSFET Transistors are a product manufactured by NXP. We provide cost-effective solutions for RF MOSFET Transistors, ensuring timely deliveries around the world.

MRF7S21080HSR3 NXP

MRF7S21080HSR3 electronic component of NXP
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Part No.MRF7S21080HSR3
Manufacturer: NXP
Category: RF MOSFET Transistors
Description: Trans RF MOSFET N-CH 65V 3-Pin NI-780S T/R
Datasheet: MRF7S21080HSR3 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
250: USD 72.4529 ea
Line Total: USD 18113.22 
Availability - 0
MOQ: 250  Multiples: 250
Pack Size: 250
   
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We are delighted to provide the MRF7S21080HSR3 from our RF MOSFET Transistors category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MRF7S21080HSR3 and other electronic components in the RF MOSFET Transistors category and beyond.

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DocumentNumber:MRF7S21080H FreescaleSemiconductor Rev. 1, 3/2011 Technical Data RFPowerFieldEffectTransistors N--Channel Enhancement--ModeLateral MOSFETs MRF7S21080HR3 Designed for CDMA base station applications with frequencies from 2110 to MRF7S21080HSR3 2170MHz.SuitableforCDMAandmulticarrieramplifierapplications.Tobe used in Class AB and Class C for TD--SCDMA and PCN--PCS/cellular radio applications. Typical Single--Carrier W--CDMA Performance: V =28Volts,I = DD DQ 2110--2170MHz,22WAVG.,28V 800 mA, P = 22Watts Avg., f = 2167.5MHz, IQ MagnitudeClipping, out Channel Bandwidth = 3.84 MHz, Input Signal PAR = 7.5 dB 0.01% SINGLEW--CDMA Probability onCCDF. LATERALN--CHANNEL Power Gain 18 dB RFPOWERMOSFETs Drain Efficiency 32% DeviceOutput Signal PAR 6.5dB 0.01%Probability onCCDF ACPR 5MHz Offset --38dBc in3.84MHz Channel Bandwidth Capable of Handling10:1 VSWR, 32Vdc, 2140MHz, 80Watts CW Peak Tuned Output Power P 1 dB CompressionPoint 80Watts CW out Features 100% PAR Tested for Guaranteed Output Power Capability CASE465--06,STYLE1 NI--780 CharacterizedwithSeries Equivalent Large--Signal Impedance Parameters MRF7S21080HR3 Internally Matchedfor Easeof Use IntegratedESD Protection Greater NegativeGate--SourceVoltageRangefor ImprovedClass C Operation Designedfor Digital PredistortionError CorrectionSystems RoHSCompliant CASE465A--06,STYLE1 In Tape and Reel. R3 Suffix = 250 Units, 56 mm Tape Width, 13 inch Reel. NI--780S MRF7S21080HSR3 Table1.MaximumRatings Rating Symbol Value Unit Drain--Source Voltage V --0.5, +65 Vdc DSS Gate--Source Voltage V --6.0, +10 Vdc GS Operating Voltage V 32, +0 Vdc DD Storage Temperature Range T --65 to +150 C stg Case Operating Temperature T 150 C C (1,2) Operating Junction Temperature T 225 C J Table2.ThermalCharacteristics (2,3) Characteristic Symbol Value Unit ThermalResistance, Junction to Case R C/W JC Case Temperature 79C, 79 W CW 0.60 Case Temperature 75C, 22 W CW 0.65 1. Continuous use at maximum temperature willaffect MTTF. 2. MTTFcalculatoravailable at Table3.ESDProtectionCharacteristics TestMethodology Class Human Body Model(perJESD22--A114) 1C (Minimum) Machine Model(perEIA/JESD22--A115) A (Minimum) Charge Device Model(perJESD22--C101) IV (Minimum) Table4.ElectricalCharacteristics (T =25Cunless otherwise noted) A Characteristic Symbol Min Typ Max Unit OffCharacteristics Zero Gate Voltage Drain Leakage Current I 10 Adc DSS (V =65Vdc,V =0Vdc) DS GS Zero Gate Voltage Drain Leakage Current I 1 Adc DSS (V =28Vdc,V =0Vdc) DS GS Gate--Source Leakage Current I 1 Adc GSS (V =5Vdc,V =0Vdc) GS DS OnCharacteristics Gate Threshold Voltage V 1.5 2 3 Vdc GS(th) (V =10Vdc,I =174Adc) DS D Gate Quiescent Voltage V 2.7 Vdc GS(Q) (V =28Vdc,I =800mAdc) DS D (1) Fixture Gate Quiescent Voltage V 4 5.5 7 Vdc GG(Q) (V =28Vdc,I =800 mAdc, Measured in FunctionalTest) DD D Drain--Source On--Voltage V 0.1 0.2 0.3 Vdc DS(on) (V =10Vdc,I =1.74Adc) GS D (2) DynamicCharacteristics Reverse TransferCapacitance C 0.64 pF rss (V =28Vdc30 mV(rms)ac 1 MHz, V =0Vdc) DS GS Output Capacitance C 296 pF oss (V =28Vdc30 mV(rms)ac 1 MHz, V =0Vdc) DS GS Input Capacitance C 160 pF iss (V =28Vdc,V =0Vdc30 mV(rms)ac 1 MHz) DS GS FunctionalTests(InFreescaleTestFixture,50ohm system)V =28Vdc,I =800mA, P =22 W Avg., f =2167.5 MHz, DD DQ out Single--CarrierW--CDMA, IQ Magnitude Clipping, PAR =7.5 dB 0.01%Probability on CCDF. ACPR measured in 3.84 MHz Channel Bandwidth 5MHzOffset. PowerGain G 16.5 18 19.5 dB ps Drain Efficiency 30 32 % D Output Peak--to--Average Ratio 0.01%Probability on CCDF PAR 5.7 6.5 dB Adjacent ChannelPowerRatio ACPR --38 --35 dBc Input Return Loss IRL --16 --9 dB 1. V =2xV . Parameter measured on Freescale Test Fixture, due to resistive divider network on the board. Refer to Test Circuit GG GS(Q) schematic. 2. Part internally matched both on input and output. (continued) MRF7S21080HR3MRF7S21080HSR3 RF DeviceData Freescale Semiconductor 2

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8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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Freescale Semiconductor - NXP
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