ESD8008 ESD Protection Diode Low Capacitance Array for High Speed Data Lines The ESD8008 is designed specifically to protect four high speed www.onsemi.com differential pairs. Ultralow capacitance and low ESD clamping voltage make this device an ideal solution for protecting voltage MARKING sensitive high speed data lines. The flowthrough style package 14 DIAGRAM allows for easy PCB layout and matched trace lengths necessary to maintain consistent impedance for the high speed lines. 1 8008M UDFN14 Features CASE 517CN Integrated 4 Pairs (8 Lines) High Speed Data Single Connect, Flow through Routing 8008 = Specific Device Code Low Capacitance (0.35 pF Max, I/O to GND) M = Date Code = PbFree Package Protection for the Following IEC Standards: IEC 6100042 Level 4 (ESD) 15 kV (Contact) IEC 6100045 (Lightning) 5 A (8/20 s) UL Flammability Rating of 94 V0 ORDERING INFORMATION SZ Prefix for Automotive and Other Applications Requiring Unique Device Package Shipping Site and Control Change Requirements AECQ101 Qualified and ESD8008MUTAG UDFN14 3000 / Tape & PPAP Capable (PbFree) Reel These Devices are PbFree, Halogen Free/BFR Free and are RoHS SZESD8008MUTAG UDFN14 3000 / Tape & Compliant (PbFree) Reel Typical Applications For information on tape and reel specifications, including part orientation and tape sizes, please VbyOne HS refer to our Tape and Reel Packaging Specification LVDS Brochure, BRD8011/D. Display Port MAXIMUM RATINGS (T = 25C unless otherwise noted) J Rating Symbol Value Unit Operating Junction Temperature Range T 55 to +125 C J Storage Temperature Range T 55 to +150 C stg Lead Solder Temperature T 260 C L Maximum (10 Seconds) IEC 6100042 Contact (ESD) ESD 15 kV IEC 6100042 Air (ESD) ESD 15 kV Maximum Peak Pulse Current I 5.0 A PP 8/20 s T = 25C (I/OGND) A Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. See Application Note AND8308/D for further description of survivability specs. Semiconductor Components Industries, LLC, 2015 1 Publication Order Number: October, 2017 Rev. 5 ESD8008/DESD8008 I/O I/O I/O I/O I/O I/O I/O I/O Pin 1 Pin 2 Pin 4 Pin 5 Pin 7 Pin 8 Pin 10 Pin 11 Center Pins, Pin 3, 6, 9, 12, 13, 14 Note: Common GND Only Minimum of 1 GND connection required Figure 1. Pin Schematic I/O 1 I/O 2 GND 14 GND 3 I/O 4 I/O 5 GND 6 13 GND I/O 7 I/O 8 9 12 GND GND I/O 10 I/O 11 Figure 2. Pin Configuration Note: Only minimum of one pin needs to be connected to ground for functionality of all pins. www.onsemi.com 2 =