MOSFET Power, N-Channel, SUPERFET III, FRFET 650 V, 65 A, 40 m NTHLD040N65S3HF Description www.onsemi.com SUPERFET III MOSFET is ON Semiconductors brandnew high voltage superjunction (SJ) MOSFET family that is utilizing charge balance technology for outstanding low on-resistance and lower gate V R MAX I MAX DSS DS(ON) D charge performance. This advanced technology is tailored to minimize conduction loss, provide superior switching performance, and 650 V 65 A 40 m 10 V withstand extreme dv/dt rate. Consequently, SUPERFET III MOSFET is very suitable for the D various power system for miniaturization and higher efficiency. SUPERFET III FRFET MOSFETs optimized reverse recovery performance of body diode can remove additional component and improve system reliability. G Features 700 V T = 150C J Typ. R = 32 m DS(on) S Ultra Low Gate Charge (Typ. Q = 159 nC) g Low Effective Output Capacitance (Typ. C = 1367 pF) oss(eff.) 100% Avalanche Tested These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant G Applications D S Telecom / Server Power Supplies TO247AD Industrial Power Supplies CASE 340AL EV Charger UPS / Solar MARKING DIAGRAM NTHD040 N65S3HF AYWWG A = Assembly Location Y = Year WW = Work Week G = PbFree Package ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Semiconductor Components Industries, LLC, 2018 1 Publication Order Number: January, 2021 Rev. 2 NTHLD040N65S3HF/DNTHLD040N65S3HF ABSOLUTE MAXIMUM RATINGS (T = 25C, Unless otherwise noted) C Symbol Parameter Value Unit V Drain to Source Voltage 650 V DSS V Gate to Source Voltage DC 30 V GSS AC (f > 1 Hz) 30 I Drain Current Continuous (T = 25C) 65 A D C Continuous (T = 100C) 45 C I Drain Current Pulsed (Note 1) 162.5 A DM E Single Pulsed Avalanche Energy (Note 2) 1009 mJ AS I Avalanche Current (Note 2) 9 A AS E Repetitive Avalanche Energy (Note 1) 4.46 mJ AR dv/dt MOSFET dv/dt 100 V/ns Peak Diode Recovery dv/dt (Note 3) 50 P Power Dissipation (T = 25C) 446 W D C Derate Above 25C 3.57 W/C T , T Operating and Storage Temperature Range 55 to +150 C J STG T Maximum Lead Temperature for Soldering, 1/8 from Case for 5 seconds 300 C L Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Repetitive rating: pulsewidth limited by maximum junction temperature. 2. I = 9 A, R = 25 , starting T = 25C. AS G J 3. I 32.5 A, di/dt 200 A/ s, V 400 V, starting T = 25C. SD DD J THERMAL CHARACTERISTICS Symbol Parameter Value Unit R Thermal Resistance, Junction to Case, Max. 0.28 C/W JC R Thermal Resistance, Junction to Ambient, Max. 40 JA PACKAGE MARKING AND ORDERING INFORMATION Part Number Top Marking Package Packing Method Reel Size Tape Width Quantity NTHLD040N65S3HF NTHLD040N65S3HF TO247 Tube N/A N/A 30 Units www.onsemi.com 2