NTMJS1D0N04C MOSFET Power, Single, N-Channel 40 V, 0.92 m , 300 A Features www.onsemi.com Small Footprint (5x6 mm) for Compact Design Low R to Minimize Conduction Losses DS(on) Low Q and Capacitance to Minimize Driver Losses G LFPAKE Package, Industry Standard V R MAX I MAX (BR)DSS DS(ON) D These Devices are PbFree and are RoHS Compliant 40 V 300 A 0.92 m 10 V MAXIMUM RATINGS (T = 25C unless otherwise noted) J Parameter Symbol Value Unit D (58) DraintoSource Voltage V 40 V DSS GatetoSource Voltage V 20 V GS Continuous Drain T = 25C I 300 A D C Current R JC G (4) T = 100C 212 (Notes 1, 3) C Steady State Power Dissipation T = 25C P 166 W C D R (Note 1) S (1,2,3) JC T = 100C 83 C NCHANNEL MOSFET Continuous Drain T = 25C I 46 A A D Current R JA T = 100C 32 (Notes 1, 2, 3) A Steady MARKING State Power Dissipation T = 25C P 3.9 W D A DIAGRAM R (Notes 1, 2) JA T = 100C 1.9 A DD D D Pulsed Drain Current T = 25C, t = 10 s I 900 A A p DM 1D0N04 Operating Junction and Storage Temperature T , T 55 to C J stg C Range + 175 LFPAK8 AWLYW Source Current (Body Diode) I 158 A S CASE 760AA Single Pulse DraintoSource Avalanche E 578 mJ AS 1 Energy (I = 34 A) L(pk) S SS G Lead Temperature for Soldering Purposes T 260 C L 1D0N04C = Specific Device Code (1/8 from case for 10 s) A = Assembly Location Stresses exceeding those listed in the Maximum Ratings table may damage the WL = Wafer Lot device. If any of these limits are exceeded, device functionality should not be Y = Year assumed, damage may occur and reliability may be affected. W = Work Week THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit ORDERING INFORMATION JunctiontoCase Steady State R 0.9 C/W JC See detailed ordering, marking and shipping information on page 5 of this data sheet. JunctiontoAmbient Steady State (Note 2) R 36 JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2 2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad. 3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2018 1 Publication Order Number: June, 2019 Rev. 0 NTMJS1D0N04C/DNTMJS1D0N04C ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 40 V (BR)DSS GS D DraintoSource Breakdown Voltage V / 16 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25 C 10 DSS GS J V = 40 V A DS T = 125C 100 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 4) Gate Threshold Voltage V V = V , I = 190 A 2.5 3.5 V GS(TH) GS DS D Threshold Temperature Coefficient V /T 7 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 50 A 0.76 0.92 m DS(on) GS D Forward Transconductance g V =15 V, I = 50 A 190 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C 6100 ISS Output Capacitance C 3400 V = 0 V, f = 1 MHz, V = 25 V pF OSS GS DS Reverse Transfer Capacitance C 70 RSS Total Gate Charge Q V = 10 V, V = 32 V I = 50 A 86 G(TOT) GS DS D Threshold Gate Charge Q 18 G(TH) nC GatetoSource Charge Q 28 GS V = 10 V, V = 32 V I = 50 A GS DS D GatetoDrain Charge Q 14 GD Plateau Voltage V 4.9 V GP SWITCHING CHARACTERISTICS (Note 5) TurnOn Delay Time t 54 d(ON) Rise Time t 162 r V = 10 V, V = 32 V, GS DS ns I = 50 A, R = 2.5 D G TurnOff Delay Time t 227 d(OFF) Fall Time t 173 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.8 1.2 SD J V = 0 V, GS V I = 50 A S T = 125C 0.65 J Reverse Recovery Time t 91 RR Charge Time t 42 a ns V = 0 V, dIS/dt = 100 A/ s, GS I = 50 A S Discharge Time t 49 b Reverse Recovery Charge Q 159 nC RR Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width 300 s, duty cycle 2%. 5. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2