Si1424EDH www.vishay.com Vishay Siliconix N-Channel 20 V (D-S) MOSFET FEATURES SC-70 (6 leads) SOT-363 Single TrenchFET power MOSFET S 4 Typical ESD protection 4000 V D 5 100 % R tested g D 6 Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 3 G APPLICATIONS 2 D D 1 Portable devices D - Load switch Top View - Battery switch Marking code: AQ R PRODUCT SUMMARY G V (V) 20 DS R max. ( ) at V = 4.5 V 0.033 DS(on) GS R max. ( ) at V = 2.5 V 0.038 DS(on) GS R max. ( ) at V = 1.8 V 0.045 DS(on) GS R max. ( ) at V = 1.5 V 0.070 DS(on) GS Q typ. (nC) 6 g S a I (A) 4 D Configuration Single ORDERING INFORMATION Package SC-70 Lead (Pb)-free and halogen-free Si1424EDH-T1-GE3 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) A PARAMETER SYMBOL LIMIT UNIT Drain-source voltage V 20 DS V Gate-source voltage V 8 GS a T = 25 C 4 C a T = 70 C 4 C Continuous drain current (T = 150 C) I J D a, b, c T = 25 C 4 A a, b, c T = 70 C 4 A A Pulsed drain current I 16 DM a T = 25 C 2.3 C Continuous source-drain diode current I S b, c T = 25 C 1.3 A T = 25 C 2.8 C T = 70 C 1.8 C Maximum power dissipation P W D b, c T = 25 C 1.56 A b, c T = 70 C 1 A Operating junction and storage temperature range T , T -55 to +150 C J stg THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYPICAL MAXIMUM UNIT b, d Maximum junction-to-ambient t 5 s R 60 80 thJA C/W Maximum junction-to-foot (drain) Steady state R 34 45 thJF Notes a. Package limited, T = 25 C C b. Surface mounted on 1 x 1 FR4 board c. t = 5 s d. Maximum under steady state conditions is 125 C/W S21-0687-Rev. C, 28-Jun-2021 Document Number: 67198 1 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 Si1424EDH www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-source breakdown voltage V V = 0 V, I = 250 A 20 - - V DS GS D V temperature coefficient V /T -18 - DS DS J I = 250 A mV/C D V temperature coefficient V /T --2.5 - GS(th) GS(th) J Gate-source threshold voltage V V = V , I = 250 A 0.4 - 1 V GS(th) DS GS D V = 0 V, V = 4.5 V - - 1.5 DS GS Gate-source leakage I GSS V = 0 V, V = 8 V - - 25 DS GS A V = 20 V, V = 0 V - - 1 DS GS Zero gate voltage drain current I DSS V = 20 V, V = 0 V, T = 55 C - - 10 DS GS J a On-state drain current I V 5 V, V = 4.5 V 15 - - A D(on) DS GS V = 4.5 V, I = 5 A - 0.027 0.033 GS D V = 2.5 V, I = 1 A - 0.031 0.038 GS D a Drain-source on-state resistance R DS(on) V = 1.8 V, I = 1 A - 0.035 0.045 GS D V = 1.5 V, I = 0.5 A - 0.040 0.070 GS D a Forward transconductance g V = 10 V, I = 3 A - 25 - S fs DS D b Dynamic V = 10 V, V = 8 V, I = 7.1 A - 11.5 18 DS GS D Total gate charge Q g -6 9 nC Gate-source charge Q V = 10 V, V = 4.5 V, I = 7.1 A -0.8 - gs DS GS D Gate-drain charge Q -1.6- gd Gate resistance R f = 1 MHz 460 2300 4600 g Turn-on delay time t - 0.3 0.45 d(on) Rise time t -0.6 0.9 r V = 10 V, R = 1.8 DD L I 5.7 A, V = 4.5 V, R = 1 Turn-off delay time t -3D GEN g.86 d(off) Fall time t -1.7 2.6 f s Turn-on delay time t -0.15 0.25 d(on) Rise time t - 0.3 0.45 r V = 10 V, R = 1.8 DD L I 5.7 A, V = 10 V, R = 1 Turn-off delay time t -5D GEN g.69 d(off) Fall time t -1.6 2.5 f Drain-Source Body Diode Characteristics Continuous source-drain diode current I T = 25 C - - 2.3 S C A Pulse diode forward current I -- 16 SM Body diode voltage V I = 5.7 A, V = 0 V - 0.85 1.2 V SD S GS Body diode reverse recovery time t -15 30 ns rr Body diode reverse recovery charge Q -7.5 15 nC rr I = 5.7 A, di/dt = 100 A/s, F T = 25 C Reverse recovery fall time t J -8 - a ns Reverse recovery rise time t -15 - b Notes a. Pulse test pulse width 300 s, duty cycle 2% b. Guaranteed by design, not subject to production testing Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S21-0687-Rev. C, 28-Jun-2021 Document Number: 67198 2 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000