NTMJS0D9N04CL MOSFET Power, Single, N-Channel 40 V, 0.82 m , 330 A Features www.onsemi.com Small Footprint (5x6 mm) for Compact Design Low R to Minimize Conduction Losses DS(on) Low Q and Capacitance to Minimize Driver Losses G V R MAX I MAX (BR)DSS DS(ON) D LFPAK8 Package, Industry Standard 0.82 m 10 V These Devices are PbFree, Halogen Free/BFR Free and are RoHS 40 V 330 A 1.2 m 4.5 V Compliant MAXIMUM RATINGS (T = 25C unless otherwise noted) J D (5,8) Parameter Symbol Value Unit DraintoSource Voltage V 40 V DSS GatetoSource Voltage V 20 V GS G (4) Continuous Drain T = 25C I 330 A C D Current R JC T = 100C 230 (Notes 1, 3) C Steady S (1,2,3) State Power Dissipation P W T = 25C 167 C D R (Note 1) NCHANNEL MOSFET JC T = 100C 83 C Continuous Drain T = 25C I 50 A A D Current R JA MARKING T = 100C 35 (Notes 1, 2, 3) A Steady DIAGRAM State Power Dissipation T = 25C P 3.8 W A D DD D D R (Notes 1, 2) JA T = 100C 1.9 A 0D9N04 Pulsed Drain Current T = 25C, t = 10 s I 900 A A p DM CL Operating Junction and Storage Temperature T , T 55 to C LFPAK8 AWLYW J stg Range +175 CASE 760AA Source Current (Body Diode) I 169 A 1 S S SS G Single Pulse DraintoSource Avalanche E 706 mJ AS Energy (I = 29 A) 0D9N04CL = Specific Device Code L(pk) A = Assembly Location Lead Temperature for Soldering Purposes T 260 C L WL = Wafer Lot (1/8 from case for 10 s) Y = Year Stresses exceeding those listed in the Maximum Ratings table may damage the W = Work Week device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS ORDERING INFORMATION See detailed ordering, marking and shipping information in the Parameter Symbol Value Unit package dimensions section on page 5 of this data sheet. JunctiontoCase Steady State R 0.9 C/W JC JunctiontoAmbient Steady State (Note 2) 36 R JA 1. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. 2 2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad. 3. Maximum current for pulses as long as 1 second is higher but is dependent on pulse duration and duty cycle. Semiconductor Components Industries, LLC, 2018 1 Publication Order Number: June, 2019 Rev. 0 NTMJS0D9N04CL/DNTMJS0D9N04CL ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 40 V (BR)DSS GS D DraintoSource Breakdown Voltage V / 18 (BR)DSS mV/C Temperature Coefficient T J Zero Gate Voltage Drain Current I V = 0 V, T = 25 C 10 DSS GS J V = 40 V A DS T = 125C 250 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 4) Gate Threshold Voltage V V = V , I = 190 A 1.2 2.0 V GS(TH) GS DS D Threshold Temperature Coefficient V /T 5.5 mV/C GS(TH) J DraintoSource On Resistance R V = 10 V I = 50 A 0.65 0.82 DS(on) GS D m V = 4.5 V I = 50 A 0.95 1.2 GS D Forward Transconductance g V = 15 V, I = 50 A 190 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C 8862 ISS Output Capacitance C 3328 V = 0 V, f = 1 MHz, V = 25 V pF OSS GS DS Reverse Transfer Capacitance C 77 RSS Total Gate Charge Q V = 4.5 V, V = 20 V I = 50 A 66 G(TOT) GS DS D Total Gate Charge Q V = 10 V, V = 20 V I = 50 A 143 G(TOT) GS DS D Threshold Gate Charge Q 6.75 nC G(TH) GatetoSource Charge Q 21.4 GS V = 4.5 V, V = 20 V I = 50 A GS DS D GatetoDrain Charge Q 22 GD Plateau Voltage V 2.7 V GP SWITCHING CHARACTERISTICS (Note 5) TurnOn Delay Time t 20 d(ON) Rise Time t 130 r V = 4.5 V, V = 20 V, GS DS ns I = 50 A, R = 1.0 D G TurnOff Delay Time t 66 d(OFF) Fall Time t 177 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.73 1.2 SD J V = 0 V, GS V I = 50 A S T = 125C 0.6 J Reverse Recovery Time t 79.5 RR Charge Time t 39 ns a V = 0 V, dIS/dt = 100 A/ s, GS I = 50 A S Discharge Time t 40.5 b Reverse Recovery Charge Q 126 nC RR Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Pulse Test: pulse width 300 s, duty cycle 2%. 5. Switching characteristics are independent of operating junction temperatures. www.onsemi.com 2