X-On Electronics has gained recognition as a prominent supplier of MCMN2012-TP MOSFETs across the USA, India, Europe, Australia, and various other global locations. MCMN2012-TP MOSFETs are a product manufactured by Micro Commercial Components (MCC). We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

MCMN2012-TP Micro Commercial Components (MCC)

MCMN2012-TP electronic component of Micro Commercial Components (MCC)
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Part No.MCMN2012-TP
Manufacturer: Micro Commercial Components (MCC)
Category: MOSFETs
Description: MOSFET 12A,20V,N Channel Mosfet
Datasheet: MCMN2012-TP Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0
MOQ : 30000
Multiples : 3000
30000 : USD 0.112
45000 : USD 0.1037
N/A

Obsolete
0
MOQ : 1
Multiples : 1
1 : USD 1.0519
10 : USD 0.8704
100 : USD 0.2368
500 : USD 0.1801
1000 : USD 0.1412
3000 : USD 0.1223
9000 : USD 0.1154
24000 : USD 0.1064
45000 : USD 0.1034
N/A

Obsolete
   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Transistor Type
Brand
Forward Transconductance - Min
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
Series
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the MCMN2012-TP from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the MCMN2012-TP and other electronic components in the MOSFETs category and beyond.

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MCMN2012 Features TrenchFET Power MOSFET Epoxy meets UL 94 V-0 Flammability Rating Moisture Sensitivity Level 1 Halogen Free. Green Device (Note 1) Lead Free Finish/RoHS Compliant Suffix designates RoHS Compliant. See ordering information) N-Channel MOSFET Maximum Ratings o o DFN2020-6J Operating Junction Temperature Range : -55 C to +150 C o o Storage Temperature Range: -55 C to +150 C o (Note 2) Maximum Thermal Resistance: 88 C/W Junction to Ambient * ) Parameter Rating Symbol Unit ( Drain -Source Voltage V 20 V + DS Gate-Source Volltage V 10 V GS Drain Current I 12 A D 2 44 4 (Note3) Drain Current-Pulse I 40 A DM 4 0 Note: 1 1. Halogen freeGreen products are defined as those which contain <900ppm bromine, - <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds , 4 3 4 Internal Structure DIMENSIONS D D S 6 5 4 INCHES MM DIM NOTE MIN MAX MIN MAX A 0.028 0.032 0.700 0.800 0.008 0.203 B TYP. C 0.000 0.002 0.000 0.050 D 0.076 0.082 1.924 2.076 1 2 3 E 0.076 0.082 1.924 2.076 Marking: N2012 D D G F 0.031 0.039 0.800 1.000 G 0.033 0.041 0.850 1.050 H 0.008 0.016 0.200 0.400 J 0.008 ----- 0.200 ----- K 0.018 0.026 0.460 0.660 L 0.026 0.650 TYP. M 0.010 0.014 0.250 0.350 N 0.007 0.013 0.174 0.326 Rev.3-4- 03202020 1/4 MCCSEMI.COMMCMN2012 ELECTRICAL CHARACTERISTICS (Ta=25 unless otherwise specified) Parameter Symbol Test conditions Min Typ Max Unit Static Characteristics Drain-Source Breakdown Voltage V V =0V, I =250A V 20 (BR)DSS GS D (Note 4) V V =V , I =250A 0.35 0.7 1.0 V GS(th) DS GS D Gate-Threshold Voltage I V = 10V, V =0V Gate-Body Leakage Current 100 nA GSS GS DS I V =20V, V =0V Zero Gate Voltage Drain Current 1 A DSS DS GS V =4.5V, I =5A 10 15 GS D Drain-Source On-Resistance R V =2.5V, I =5A m 13 18 DS(on) GS D V =1.8V, I =5A 18 30 GS D (Note 4) V =4V, I =9.7A g 20 S Forward Tranconductance FS DS D Diode Forward Voltage V V =0V, I =10A V 1.2 SD GS S (Note 5) Dynamic Characteristics C Input Capacitance 1800 iss V =4V,V =0V, f=1MHz Output Capacitance C pF DS GS 650 oss C Reverse Transfer Capacitance 450 rss Gate Resistance R f=1MHz 2.5 g (Note 5) Switching Characteristics t Turn-On Delay Time 12 20 d(on) Turn-On Rise Time t 10 15 r V =4V,V =4.5V,R =0.4, DD GEN L ns I =10A,R =1 D G t Turn-Off Delay Time 65 100 d(off) Turn-Off Fall Time t 20 30 f Total Gate Charge Q 32 g V =4V,Vgs=5V,I =10A nC Gate-Source Chage Q DS D 2.5 gs Gage-Drain Charge Q 6.5 gd Note: 2. Surface Mounted On FR4 Board Using The Minimum Pad Size,1oz Copper. 3. Surface Mounted On FR4 Board Using 1 Square Inch Pad Size, 1oz Copper. 4. Pulse Test: Pulse Width300s,Duty Cycle2%. 5. These Parameters Have No Way To Verify. Rev.3-4- 03202020 2/4 MCCSEMI.COM

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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